Method for manufacturing a multilayer flexible wiring board
a manufacturing method and flexible technology, applied in the direction of circuit masks, other domestic objects, transportation and packaging, etc., can solve the problems of difficult control of dimensional changes in each layer of wiring boards, difficulty in stacking wiring boards to electrically connect,
Inactive Publication Date: 2007-07-19
DEXERIALS CORP
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- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
This approach enables precise positioning and efficient stacking of individual layers, reducing thickness variations and simplifying the manufacturing apparatus, resulting in a stable and reliable multilayer flexible wiring board production.
Problems solved by technology
With the prior art as described above, dimensional changes may vary between layers of wiring boards due to heat shrinkage during manufacturing processes or other factors, which means difficulty in stacking the wiring boards to electrically connect them.
Further, it is difficult to control dimensional changes in each layer of wiring board by this technique.
Method used
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Embodiment Construction
[0020] One embodiment of a flexible wiring board in accordance with the present invention will now be described in detail with reference to the drawings.
[0021]FIG. 1 (a) shows a schematic structure of a stock sheet for a flexible wiring board according to the present embodiment and FIG. 1 (b) shows a sectional view along A-A line in FIG. 1 (a).
[0022] As shown in FIG. 1 (a), a stock sheet for a flexible wiring board 1 according to the present embodiment is transported in the direction shown by an arrow and taken up by a roll (not shown), and comprises a long film-like substrate 2 on which a plurality of identical wiring patterns 3 corresponding to a plurality of layers (6 layers in this embodiment) of a multilayer flexible wiring board (not shown) are arranged in the direction (width direction) perpendicular to the transporting direction P of substrate 2.
[0023] In the present embodiment, wiring patterns 3 are formed on one side of substrate 2 and overlaid with a cover film 7 excep...
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Abstract
In one embodiment, the present invention provides a process for manufacturing a multilayer flexible wiring board, which allows individual layers of wiring boards to be precisely positioned and to be readily stacked. A mask for exposure is prepared in which a plurality of pattern holes corresponding to individual layers of wiring boards of a multilayer flexible wiring board are arranged in the direction perpendicular to the transporting direction P of substrate. This mask for exposure is used to form a plurality of wiring patterns corresponding to individual layers of wiring boards of a multilayer flexible wiring board on the same sheet-like substrate.
Description
FIELD OF THE INVENTION [0001] The present invention relates to processes for manufacturing flexible wiring boards made of a polyimide for example. More particularly, the invention relates to a technique of stacking a plurality of layers of flexible wiring boards. BACKGROUND OF THE INVENTION [0002] Flexible printed wiring boards comprising a circuit formed of a layer of a conductor such as a copper foil stacked on a flexible insulating film are known in the art. [0003] With recent trends toward smaller electronic components, such flexible wiring boards involve connecting electrodes with finer pitches and an advanced multilayer structure. [0004] This type of multilayer flexible wiring boards have typically been prepared by positioning each layer of wiring board to form a wiring pattern and bonding these layers into a multilayer structure. [0005] With the prior art as described above, dimensional changes may vary between layers of wiring boards due to heat shrinkage during manufacturin...
Claims
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IPC IPC(8): H05K3/20H05K1/00H05K3/00H05K3/06H05K3/46
CPCH05K1/0393Y10T29/49128H05K3/002H05K3/0082H05K3/064H05K3/4007H05K3/423H05K3/4614H05K3/4635H05K2201/0166H05K2201/0367H05K2203/056H05K2203/0733H05K2203/1545Y10S428/901Y10T29/49155Y10T29/49165Y10T428/24917H05K3/0002H05K3/46
Inventor KANEDA, YUTAKA
Owner DEXERIALS CORP