Radiation imaging apparatus and radiation imaging system

Inactive Publication Date: 2007-11-29
CANON KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0008]The present invention has been made based on the above findings, an

Problems solved by technology

At the same time, because the radiation imaging apparatus outputs images by digitally converting minute signals, there may be deterioration of the S / N ratio of a captured image if there is even a small amount of noise in the minute signals.

Method used

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  • Radiation imaging apparatus and radiation imaging system
  • Radiation imaging apparatus and radiation imaging system
  • Radiation imaging apparatus and radiation imaging system

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Experimental program
Comparison scheme
Effect test

first embodiment

[0051]FIG. 1 is a plan view of the radiation imaging apparatus according to a preferred embodiment of the present invention. FIG. 2 is a sectional view of the dashed line A-A′ of one pixel shown in FIG. 1. FIG. 3 is a sectional view of the dashed line B-B′ of an intersection 102 of the Sig connection hole 103, the Vs line, and the Sig line. In addition, although FIG. 1 shows pixels of 3 columns ×2 rows, the number of pixels is not limited to this.

[0052]The radiation imaging apparatus according to the present embodiment uses an MIS photoelectric conversion element as a conversion element, and is an indirect-type radiation imaging apparatus which has a scintillator located at the upper part for converting radiation into visible light. The equivalent circuit diagram and operation principles of the radiation imaging apparatus according to the present embodiment are similar to those for the radiation imaging apparatus shown in FIG. 11 and FIG. 12, so their description will be omitted her...

second embodiment

[0061]FIG. 4 is a plan view of the radiation imaging apparatus according to a preferred embodiment of the present invention. FIG. 5 is a sectional view of the dashed line C-C′ of one pixel shown in FIG. 4. FIG. 6 is a sectional view of the dashed line D-D′ of an intersection 402 of the following components of FIG. 4: a Sig connection hole 403, the Vs line and the Sig line. In addition, FIG. 4 shows a pixel of 3 columns×2 rows, but the pixel number is not restricted to this.

[0062]The radiation imaging apparatus according to the present embodiment uses a PIN photoelectric conversion element as a conversion element, and is an indirect-type radiation imaging apparatus which has, at the top part, a scintillator which converts radiation into visible light. The equivalent circuit diagram of the radiation imaging apparatus according to the present embodiment is similar to the radiation imaging apparatus shown in FIG. 11, and therefore its description will be omitted.

[0063]The operation prin...

third embodiment

[0070]FIG. 7 is a plan view of the radiation imaging apparatus according to a preferred embodiment of the present invention. FIG. 8 is a sectional view of the dashed line E-E′ of one pixel shown in FIG. 7. FIG. 9 is a sectional view of the dashed line F-F′ of the intersection 701 of the Sig connection hole 702, the Vs line and the Sig line shown in FIG. 7. In addition, FIG. 1 shows pixels of 3 columns×2 rows, but the pixel number is not limited to this.

[0071]The radiation imaging apparatus according to the present embodiment uses a PIN photoelectric conversion element as the conversion element, and is an indirect-type radiation imaging apparatus which has a scintillator in the upper part for converting radiation into visible light. The equivalent circuit diagram of the radiation imaging apparatus according to the present embodiment is similar to that of the radiation imaging apparatus shown in FIG. 11, and, since its operation principles are the same as those of the second embodimen...

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Abstract

A radiation imaging apparatus has a pixel region arranged on a substrate. Arranged in a matrix pattern in the pixel region are pixels, each pixel including a conversion element which converts radiation to electrical charges, and a switching element which is connected to the conversion element therein. The radiation imaging apparatus has, in a region outside the pixel region of the substrate, an intersection at which a signal line connected to the switching element and a bias line connected to the conversion element intersects. At the intersection, a semiconductor layer is arranged between the signal line and the bias line, and a carrier blocking portion is arranged between the semiconductor layer and the signal line.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a radiation imaging apparatus using radiation and a radiation imaging system.[0003]2. Description of the Related Art[0004]Recently, there have been advances in manufacturing techniques of liquid crystal display panels that use switching elements such as thin-film transistors (TFTs). There is a trend towards enlargement of panels and display units. These manufacturing techniques have been applied to large area sensors having conversion elements such as semiconductor conversion elements and switching elements. This has led to the full digitalization of such fields as the radiation imaging apparatus field (see Japanese Patent Laid-Open No. 2006-4998).[0005]Conversion elements used in radiation imaging apparatuses can be divided into direct and indirect types. A direct conversion element directly converts radiation into electric charges. An indirect conversion element carries out radiation-t...

Claims

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Application Information

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IPC IPC(8): G01T1/24H01L27/146H01L25/00H01L27/00
CPCG01T1/24H01L27/14603H01L27/14632G01T1/2018H01L27/14663H01L27/14692H01L31/105H01L27/14643
InventorISHII, TAKAMASAMOCHIZUKI, CHIORIWATANABE, MINORU
OwnerCANON KK