Probe polishing method and probe polishing member

Abstract

In a probe polishing method, a plurality of probes, which are arranged on a probe card for performing an inspection of electrical characteristics of a target object, are polished by using a polishing member. Further, the probes are polished over plural times, while changing a relative position of the abrasive sheet with respect to the probe card.

Description

[0001]This application is a Continuation of application Ser. No. 11 / 611,516 which was filed on Dec. 15, 2006 and claims priority to Japanese Application No. 2005-364879 filed Dec. 19, 2005, the entire contents of which are incorporated herein by reference.FIELD OF THE INVENTION[0002]The present invention relates to a probe polishing method and a probe polishing member employed in a probe apparatus; and, more particularly, to a probe polishing method and a probe polishing member capable of reducing time required for polishing probes without increasing the size of the probe apparatus, thus improving a throughput of inspection with a small probe apparatus.BACKGROUND OF THE INVENTION[0003]As illustrated in FIG. 7, a conventional probe apparatus includes, in a probe chamber, a mounting table 1 for mounting thereon an object to be inspected (e.g., a wafer W) and incorporating therein an elevation mechanism and a rotation mechanism; an X-stage 2 supporting the mounting table 1 and movable ...

AI Technical Summary

Benefits of technology

The present invention provides a method and member for polishing probes on a probe card for inspecting electrical characteristics of a target object. The polishing member has a slant portion that is inclined outwardly downwardly, which allows for efficient and reliable polishing of the probes even when the arrangement region of the probes is not fully covered. The polishing member can be mounted on a movable mounting table or formed of an abrasive sheet with a slant surface. The method involves polishing the probes multiple times while changing the relative position of the polishing member with respect to the probe card. This improves inspection throughput and ensures reliable and efficient polishing of the probes.

Problems solved by technology

In such a case, though the probes 4A may be polished after separating the probe card 4 from the probe apparatus, a considerable amount of time is required for the separation and reinstallation of the probe card 4, which results in deterioration of a polishing efficiency.

Thus, a considerable amount of time is required for the installation of the polishing member, so that the efficiency of the polishing work is deteriorated.

Further, an additional device for installing the polishing member is required, thereby increasing a cost.

Besides, in case of a large probe card capable of contacting with the entire region of a wafer at one time, although it is possible to polish all of the probes of the probe card simultaneously, it is inevitable that the same portions of the polishing member are used repetitively because the polishing member cannot be index fed.

Thus, the polishing member cannot be utilized efficiently.

Moreover, due to the large size of the polishing member, an extra space is required for the accommodation of the polishing member, which increases the entire size of the probe apparatus.

Thus, a rotation mechanism and an elevation mechanism for the polishing member are additionally needed, which makes the entire mechanism of the probe apparatus complicated.

Further, since the same portions of the polishing member are repetitively used to polish probes as similar to the case of Reference 1, the work efficiency of the polishing member is poor.

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