Capacitor-embedded printed circuit board and manufacturing method thereof

a printed circuit board and capacitor technology, applied in the direction of fixed capacitors, variable capacitors, fixed capacitor details, etc., can solve problems such as failures in the reliability of capacitors and errors in the contact area between dielectric layers, and achieve the effect of reducing failures in capacitan

Inactive Publication Date: 2009-02-19
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The invention provides a method for manufacturing a capacitor-embedded printed circuit board with minimized errors in capacitance. The method involves forming electrodes on the insulation layer using different etchants, and controlling the thickness of the electrodes. The resulting printed circuit board has reduced errors in capacitance and improved performance.

Problems solved by technology

Here, deviations may occur due to the etching, during the forming of the lower electrode, which may cause errors in the area of contact between the dielectric layer and the lower electrodes.
As a result, errors may occur also in the capacitance value of the capacitor, creating problems in the reliability of the capacitor.

Method used

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  • Capacitor-embedded printed circuit board and manufacturing method thereof
  • Capacitor-embedded printed circuit board and manufacturing method thereof
  • Capacitor-embedded printed circuit board and manufacturing method thereof

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Embodiment Construction

[0030]The capacitor-embedded printed circuit board and manufacturing method thereof based on certain embodiments of the invention will be described below in more detail with reference to the accompanying drawings. Those elements that are the same or are in correspondence are rendered the same reference numeral regardless of the figure number, and redundant explanations are omitted.

[0031]FIG. 1 is a cross-sectional view illustrating an embodiment of a capacitor-embedded printed circuit board based on one aspect of the present invention, and FIG. 2 and FIG. 3 are cross-sectional views illustrating etching deviations according to the thickness of the electrodes in a capacitor.

[0032]The terms “upper electrode” and “lower electrode” describe relative concepts, and thus may be substituted one for the other. For convenience, however, the descriptions that follow will use “upper electrode” to refer to the electrode positioned over the dielectric layer, and “lower electrode” to refer to the ...

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Abstract

A capacitor-embedded printed circuit board and a method of manufacturing the printed circuit board are disclosed. The capacitor-embedded printed circuit board includes: an insulation layer, a first electrode formed on one side of the insulation layer, a second electrode formed on one side of the first electrode, a dielectric layer formed on one side of the second electrode, and a third electrode formed on one side of the dielectric layer. By forming the electrodes of the capacitor in a dual structure, deviations in contact area may be minimized between the second electrode and the dielectric layer, so that ultimately, errors in capacitance may be reduced.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims the benefit of Korean Patent Application No. 10-2007-0082676 filed with the Korean Intellectual Property Office on Aug. 17, 2007, the disclosure of which is incorporated herein by reference in its entirety.BACKGROUND[0002]1. Technical Field[0003]The present invention relates to a printed circuit board having embedded capacitors and to a method of manufacturing the printed circuit board.[0004]2. Description of the Related Art[0005]While most printed circuit boards had discrete chip resistors or discrete chip capacitors mounted on the surface in the past, printed circuit boards having embedded passive components such as resistors and capacitors, etc., have recently been developed.[0006]The technology for the printed circuit board having embedded passive components employs new materials and new processes to insert the passive components, such as resistors or capacitors, etc., into the exterior or interior of the board...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): H01G4/005H01G7/00
CPCH05K1/162H05K3/062H05K3/4626H05K3/4652H05K3/4655Y10T29/435H05K2201/09509H05K2201/09672H05K2201/09881Y10T29/49126H05K2201/0195Y10T29/49155Y10T29/49156H05K1/16
InventorKWEON, YOUNG DOYI, SUNGKIM, HONG-WON
OwnerSAMSUNG ELECTRO MECHANICS CO LTD