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Foam Buffer Device for Packaging

a buffer device and foam block technology, applied in the field of protective packaging systems and apparatuses, can solve the problems of aging process, time-consuming and laborious, and the size and shape of foam block packaging materials can be limited, and the thickness of the cross section will require even more time for the aging process

Inactive Publication Date: 2009-03-19
WANG ZHENYONG +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

"The invention is a foam buffer device that protects computer system components during transport. It consists of a foam block with a socket for inserting the computer component, and a nonplanar foam extrusion that forms a wall around the computer component. The foam block also has bumpers to prevent direct contact with surfaces. The nonplanar foam extrusion is foldable and can be easily formed into a socket for the computer component. The technical effect of this invention is to provide a reliable and effective way to protect computer system components during transport."

Problems solved by technology

Some foam block packaging materials can be limited in size and shape by the manufacturing processes.
This aging process can require time (weeks) for the migration of air into the bubbles of the foam, and thicker cross sections will require even more time for the aging process.
Thus, thicker cross sections in a non-planar extruded foam profile can incur greater storage / processing costs than thinner profiles.
This sheet lamination process can produce unwanted voids or separations between large area laminations.
When detected, the separations between large area laminations can cause unwanted scrap and wastage of separated foam materials, and when undetected, the separations can adversely affect the buffering protection provided during transit, and could cause unwanted damage to fragile products.
The geometric profile can have height and width, and can be quite complex in shape.
Thus, thicker EPE materials can prolong the post processing time needed to produce an aged lot of the EPE material, and can require additional warehouse storage space to wait for the thicker EPE material to age.
This lengthened gas exchange process has the effect of reducing the productivity of a unit of warehouse space as thicker materials are processed.
Consequently, a significant need exists for an improved foam block packaging product which exhibits excellent cost, shock, and vibration characteristics, eliminates lamination failures, and results in reduced processing time and in reduced storage space.

Method used

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  • Foam Buffer Device for Packaging
  • Foam Buffer Device for Packaging
  • Foam Buffer Device for Packaging

Examples

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Embodiment Construction

[0024]The following description of certain examples of the invention should not be used to limit the scope of the present invention. Other examples, features, aspects, embodiments, and advantages of the invention will become apparent to those skilled in the art from the following description, which is by way of illustration, one of the best modes contemplated for carrying out the invention. As will be realized, the invention is capable of other different and obvious aspects, all without departing from the invention. Accordingly, the drawings and descriptions should be regarded as illustrative in nature and not restrictive.

[0025]In FIG. 1, an exploded isometric view shows a buffer device 20 of the present invention being placed onto one end of a computer system component 70 prior to transport. Buffer device 20 comprises a foam block 22 formed at least in part from a non-planar foam extrusion (not shown in FIG. 1), and is configured with a component socket 24 to engage with the compon...

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PUM

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Abstract

A packaging apparatus comprising a foam buffer that provides protection of a computer system component during transit, provides ease of use during pre-packing and packing of the component for transport, does not require the need for additional packing components in combination with the packaging assembly, provides shock and vibration protection during transport, and the foam buffer is configured for ease of manufacture, for reduced manufacturing time and for reduced cost. The foam buffer comprises a foam block formed at least in part from a nonplanar foam extrusion to protect the computer system components during transport. A component socket is provided in the foam block for the reception of the component, and the geometry of the foam surrounding the received computer is configured to provide protection and for ease of manufacture. An exterior of the foam block comprises alternating bands of curvilinear ribs and grooves to provide the desired buffering and shock characteristics, and to reduce manufacturing time by promoting air or gas passage from the foam. Alternate embodiments of the nonplanar foam extrusion can comprise a “U” and an “L” shaped foam extrusion, and the foam block can be assembled from a single continuous piece of a foam extrusion or an assembly of multiple extrusions.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]The present application hereby claims the benefit of the provisional patent application of the same title, Ser. No. 60 / 939,433 filed on May 22, 2007.FIELD OF THE INVENTION[0002]The present invention relates, in general, to the protective packaging systems and apparatuses therein, and more particularly to a creating a foam buffer device using specific geometrical configurations for protectively accommodating fragile items such as electronic computer equipment during transport.BACKGROUND OF THE INVENTION[0003]Fragile devices, such as electronic devices or computer system components, can use foam block packaging to protect the fragile components from unwanted shock and vibration during the transport process. This ensures that the components arrive unharmed and ready for use. Foam block packaging can be placed on opposing ends of a component, and when placed in a cardboard box, suspend the component within the box for transit. Some foam block...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B65D85/30
CPCB65D81/113
Inventor WANG, ZHENYONGZHU, MINGFEIYEO, CHIN THIAM
Owner WANG ZHENYONG