Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Fixed Abrasive Pad Having Different Real Contact Areas and Fabrication Method Thereof

a technology of fixed abrasives and real contact areas, which is applied in the direction of dough shaping, manufacturing tools, applications, etc., can solve the problems of reducing the yield of semiconductor devices, consuming a relatively large working time, and disabling or disfiguring the minute surface topology of the roller, so as to reduce or prevent adverse effects

Inactive Publication Date: 2009-05-21
CHOI JAE YOUNG
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a fixed abrasive pad with multiple polishing areas of different real contact areas. This pad can reduce or prevent adverse effects due to variations in removal rates caused by the surface morphology of the wafer during chemical mechanical polishing. The method for fabricating this pad involves attaching a plurality of etching molds to a roller or a press, and creating a fixed abrasive pad using the roller or press. This fixed abrasive pad has a plurality of polishing portions with different real contact areas, which can provide more uniform polishing results.

Problems solved by technology

The above-described CMP process has been widely used as a planarization process of metallization layers, however, the CMP process often results in a problem where the yield of semiconductor devices decreases due to failures such as a dishing or erosion phenomenon.
However, fabricating a roller by a cutting tool consumes a relatively large working time, and may also disable or disfigure the minute surface topology of the roller.
As a result, two different CMP apparatuses or equipment are necessary to simultaneously polish wafers with and without patterns, which is not desirable in the aspect of processing efficiency and / or efficient use of fab / clean room floor space.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Fixed Abrasive Pad Having Different Real Contact Areas and Fabrication Method Thereof
  • Fixed Abrasive Pad Having Different Real Contact Areas and Fabrication Method Thereof
  • Fixed Abrasive Pad Having Different Real Contact Areas and Fabrication Method Thereof

Examples

Experimental program
Comparison scheme
Effect test

first embodiment

A First Embodiment

[0028]Firstly, an etching mold is formed, having a surface morphology opposite or complementary to the shape that is desired on a surface (e.g., the polishing surface) of the polishing pad. An exemplary etching mold is shown in FIG. 3. A metal material such as stainless steel is etched using a metal etching technique to form the mold, such as that shown in FIG. 3. The etching molds may be formed in at least two separate pieces, wherein one etching mold provides a polishing pad or pad region that has a different real contact area from another polishing pad or pad region. Alternatively, the mold may be formed in one unitary piece.

[0029]Next, the etching mold(s) providing different real contact areas are attached to a surface of roller. Preferably, the roller includes through-holes whereby a vacuum can be applied (e.g., to the inside of the roller), and the etching molds may be attached to the surface of the roller by a vacuum absorption mechanism.

[0030]A fixed abrasi...

second embodiment

A Second Embodiment

[0035]The second embodiment of a method for fabricating a fixed abrasive pad having different real contact areas utilizes a press.

[0036]Firstly, a mixture of abrasive particles, a binding agent, and (optionally) a hardening agent is applied on a polycarbonate film constituting a base of the fixed abrasive pad, and then a polishing film is formed by a rolling method using a roller. Here, the roller has no surface morphology, and the polishing film is temporarily hardened in a constant thickness. Next, the etching molds having different real contact areas are respectively attached to a press.

[0037]Subsequently, the temporarily hardened polishing film is positioned on the press, and then is pressed or deformed by the press under a predetermined heat and pressure. After then, the polishing film is cooled, thus forming a fixed abrasive pad having one or more regions of relatively low real contact area and one or more regions of relatively high real contact area.

[0038]F...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
widthaaaaaaaaaa
widthaaaaaaaaaa
real contact areaaaaaaaaaaa
Login to View More

Abstract

Disclosed is a method for fabricating a fixed abrasive pad in use of a chemical mechanical polishing process. The method includes: forming one or more etching molds providing a plurality of different real contact areas; attaching the etching mold(s) to a roller or press; and forming a fixed abrasive pad using the roller or press, The fixed abrasive pad has a plurality of polishing portions, each having a different real contact area. Especially, the fixed abrasive pad can comprise a low-density polishing portion having a real contact area less than 20% and a high-density polishing portion having a real contact area of 20%˜50%.

Description

[0001]This application is a divisional of pending U.S. patent application Ser. No. 11 / 484,527, filed Jul. 10, 2006 (Attorney Docket No. OPP-GZ-2007-0400-US-00), which is incorporated herein by reference in its entirety and which claims the benefit of Korean Patent Application No. 10-2005-0061837, filed on Jul. 8, 2005, which is incorporated herein by reference in its entirety.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a fixed abrasive pad and fabrication method thereof. More specifically, the present method relates to a fixed abrasive pad having different real contact areas in use in a chemical mechanical polishing (CMP) process, and a method for forming different real contact areas on a fixed abrasive pad.[0004]2. Description of the Related Art[0005]There have been a variety of alterations in structural and material aspects for the purpose of achieving a higher operational speed and integration of a semiconductor device. In the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): B24B1/00B24D11/04B24B7/20
CPCB24D11/001H01L21/304
Inventor CHOI, JAE YOUNG
Owner CHOI JAE YOUNG
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com