Printhead Integrated Circuit With Low Operating Power

a technology of integrated circuits and printing heads, which is applied in the direction of printing, other printing apparatus, etc., can solve the problems of reducing limiting the size of the nozzle array, and reducing the volume of the ink chamber, so as to reduce the volume of ink, and limit the print speed

Inactive Publication Date: 2009-11-05
SILVERBROOK RES PTY LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0018]Configuring the actuators for low power ejection causes less cross talk between nozzles and less, if any, excess heat generation. As a result, the density of the droplet ejectors on the printhead IC can increase. Droplet ejector density has a direct bearing on the print resolution and or print speeds. A high density array of nozzles can print to all the addressable locations (the grid of locations on the media substrate at which the printer can print a dot) with less passes of the printhead or ideally, a single pass, as is the case with a pagewidth printhead.
[0053]Increasing the speed of the media substrate relative to the printhead, whether the printhead is a scanning or pagewidth type, reduces the time needed to complete printjobs.

Problems solved by technology

Accurate registration between the thermal actuators and the nozzles can be problematic.
These problems effectively restrict the size of the nozzle array in any one monolithic plate and corresponding actuator substrate.
Furthermore, differential thermal expansion between the nozzle plate and the actuator substrate create greater misalignments as the array sizes increase.
Given these limits on nozzle array size, pagewidth printheads using this two-part design are impractical.
The complexity of this arrangement make such printers commercially unrealistic.
Each technology may have its own advantages and disadvantages in the areas of cost, speed, quality, reliability, power usage, simplicity of construction operation, durability and consumables.

Method used

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  • Printhead Integrated Circuit With Low Operating Power
  • Printhead Integrated Circuit With Low Operating Power
  • Printhead Integrated Circuit With Low Operating Power

Examples

Experimental program
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Embodiment Construction

[0075]In the preferred embodiment, shape memory materials are utilised to construct an actuator suitable for injecting ink from the nozzle of an ink chamber.

[0076]Turning to FIG. 1, there is illustrated an exploded perspective view 10 of a single ink jet nozzle as constructed in accordance with the preferred embodiment. The ink jet nozzle 10 is constructed from a silicon wafer base utilizing back etching of the wafer to a boron doped epitaxial layer. Hence, the ink jet nozzle 10 comprises a lower layer 11 which is constructed from boron-doped silicon. The boron doped silicon layer is also utilized as a crystallographic etch stop layer. The next layer comprises the silicon layer 12 that includes a crystallographic pit that defines a nozzle chamber 13 having side walls etched at the conventional angle of 54.74 degrees. The layer 12 also includes the various required circuitry and transistors for example, a CMOS layer (not shown). After this, a 0.5-micron thick thermal silicon oxide la...

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PUM

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Abstract

An inkjet printhead that has an array of droplet ejectors supported on a printhead integrated circuit (IC). Each of the droplet ejectors has a nozzle aperture and an actuator for ejecting a droplet of ink through the nozzle aperture. When printing 100% coverage at full print rate, each of the actuators has an average power consumption less than 1.5 mW.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]The present application is a continuation-in-part of U.S. application Ser. No. 11 / 926,109 filed on Oct. 28, 2007, which is a continuation of U.S. application Ser. No. 11 / 778,572 filed on Jul. 16, 2007, which is a continuation of U.S. application Ser. No. 11 / 349,074 filed on Feb. 8, 2006, now issued U.S. Pat. No. 7,255,424, which is a continuation of U.S. application Ser. No. 10 / 982,789 filed on Nov. 8, 2004, now issued U.S. Pat. No. 7,086,720, which is a continuation of U.S. application Ser. No. 10 / 421,823 filed on Apr. 24, 2003, now issued U.S. Pat. No. 6,830,316, which is a continuation of U.S. application Ser. No. 09 / 113,122 filed on Jul. 10, 1998, now issued U.S. Pat. No. 6,557,977, all of which are herein incorporated by reference.CROSS REFERENCES TO RELATED APPLICATIONS[0002]The following US patents and US patent applications are hereby incorporated by cross-reference.US Patent / Patent ApplicationIncorporated by Reference:Docket No.6...

Claims

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Application Information

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IPC IPC(8): B41J29/38
CPCB41J2/14427B41J2/1626B41J2/1648B41J2/1642B41J2/1631
Inventor SILVERBROOK, KIA
Owner SILVERBROOK RES PTY LTD
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