Evaporator for looped heat pipe system

Abstract

An evaporator for a looped heat pipe (LHP) system, the evaporator including a plurality of wicks having pores formed therein; a plurality of heat transferring fins respectively having a wick coupler to be coupled to one of the plurality of wicks; a plurality of unit assemblies formed by respectively coupling each of the wicks and each of the heat transferring fins; an assembly structure formed by horizontally disposing the unit assemblies to enable a bottom surface of each of the unit assemblies to be located on a planar surface; a heat transferring plate coupled to a bottom part of the assembly structure; and a covering member coupled to the heat transferring plate.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]The present application is a continuation of pending International patent application PCT / KR2008 / 005694 filed on Sep. 25, 2008, which designates the United States and claims priority from Korean patent application 10 2008 0092421 filed on Sep. 25, 2008, the content of which is incorporated herein by reference.FIELD OF THE INVENTION[0002]The present invention relates to an evaporator for a looped heat pipe (LHP) system including a condenser, a vapor transport line, and a liquid transport line, and more particularly, to an evaporator for a LHP system, wherein the evaporator has a structure in which a wick and a heat transferring fin to be coupled to the wick are separately formed and then coupled to a heat transferring plate in a wing direction, and wherein the wick and the heat transferring fin are respectively formed having various shapes and sizes so that the thermal contact resistance between the wick and the heat transferring fin can b...

AI Technical Summary

Benefits of technology

[0023]The present invention provides an evaporator for a looped heat pipe (LHP) system, wherein heat transferring fins of the evaporator can be formed in various shapes, and wicks of the evaporator can be formed in various shapes and of various materials, thereby improving a contact state between the heat transferring fins and the wicks.

Problems solved by technology

Electronic parts such as central processing units (CPUs) or semiconductor chips used for various electronic devices such as computers generate a large amount of heat during operation.

Even though the sintered wicks and the base functioning as a heat plate apparently form a large cross-contact area, if a state of an actual contact interface between the sintered wicks and the base is not desirable, a heat transfer toward the sintered wicks is not smoothly performed.

However, there is a limit in forming the inner structures in the desired shapes, and in this case, a state of the contact surface is not desirable such that heat transfer is not effectively performed.

Such limits are major factors that make improvement of a contact surface state difficult.

Thus, there is a limit in obtaining the various shapes of the wicks 410.

Accordingly, the thermal contact resistance is high due to an undesirable state of a contact interface between the protrusion 120 and the wick 410, and cooling of an electronic part is not effectively performed.

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