Heat dissipation device

Abstract

A heat dissipation device includes a first heat sink, a second heat sink juxtaposed with the first heat sink and a plurality of heat pipes thermally connecting the first heat sink and the second heat sink. The first heat sink includes a plate-like spreader used for contacting with a first electric component and a honeycomb-like first fin unit thermally attached on the spreader. The spreader is a flat heat pipe. The heat pipes each include a flat plate-shaped evaporating section sandwiched between the spreader and the first fin unit of the first heat sink and a condensing section extending in the second heat sink. Due to a provision of the honeycomb-like first fin unit, the heat dissipation area of the first heat sink greatly increases.

Description

BACKGROUND OF THE INVENTION [0001]1. Field of the Invention[0002]The present invention relates generally to heat dissipation devices, and more particularly to a heat dissipation device having excellent heat dissipating efficiency.[0003]2. Description of Related Art[0004]Computer electronic components, such as central processing units (CPUs), generate great amounts of heat during normal operation thereof. If the heat is not properly dissipated, it can deteriorate an operational stability of the electronic components and damage associated electronic devices. Thus the heat must be removed quickly to ensure normal operation of these electronic components. A heat dissipation device is often attached to a top surface of a CPU to remove heat therefrom.[0005]Conventionally, a heat dissipation device attached to a CPU includes a solid base, a plurality of fins arranged on the base, and a plurality of heat pipes extending in the base and the fins. A plurality of grooves is defined in the base...

AI Technical Summary

Benefits of technology

[0007]According to a preferred embodiment of the present invention, a heat dissipation device includes a first heat sink, a second heat sink juxtaposed with the first heat sink, and a pair of heat pipes thermally connecting the first and second heat sinks. The first and second heat sinks are for attaching to first and second CPUs, respectively. The first heat sink includes a plate-shaped spreader thermally attached to the first CPU and a honeycomb-like first fin unit thermally attached on the spreader. The heat pipes each include an evaporating section received in the first fin unit and tightly sandwiched between the spreader and the first fin unit and a condensing section extending in the second heat sink. The spreader is a flat heat pipe. Due to a provision of the honeycomb-like first fin unit, the heat-dissipation area of the first heat sink is greatly increased and the heat dissipating efficiency of the heat dissipation device is accordingly enhanced.

Problems solved by technology

Computer electronic components, such as central processing units (CPUs), generate great amounts of heat during normal operation thereof.

If the heat is not properly dissipated, it can deteriorate an operational stability of the electronic components and damage associated electronic devices.

However, the heat originating from the CPU is directly absorbed by a middle part of the base and cannot quickly spread to other parts of the base.

This results in an overheating of the middle part of the base, while the other parts of the base have a lower temperature relative to the middle part.

The fins on the other parts of the base away from the middle part are not efficiently used.

Additionally, the fins of a conventional heat sink which have the fins extending upwardly and perpendicularly from the base thereof, do not have a sufficiently large heat-dissipation area to remove heat from the CPU; thus, the heat dissipating efficiency of the heat dissipation device is poor.

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