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Electrolytic plating equipment and electrolytic plating method

a technology of electrolysis and plating equipment, applied in the direction of electrolysis components, cells, tanks, etc., can solve the problems of reducing the effect of controlling precipitation on the board surface, reducing the cost of filter replacement, and less dense coatings with inferior physical properties

Inactive Publication Date: 2011-03-10
C UYEMURA & CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0013]It is an object of the present invention to provide an electrolytic plating equipment and electrolytic plating method whereby the dissolved oxygen concentration of a plating solution can be adjusted and costs associated with filter replacement reduced.

Problems solved by technology

If there is too much promoter in the plating solution, however, the ability of the suppressor to suppress growth of active nuclei will be reduced, resulting in a less dense coating with inferior physical properties.
The effect of controlling precipitation on the board surface will also be reduced, causing problems with throwing of the through holes, filling of the blind via holes and the like.
If there is too little promoter in the plating solution, on the other hand, it will be less able to promote formation of active nuclei, resulting in a less dense coating with inferior physical properties.
The promoting effects within the through holes and blind via holes may also be insufficient, causing problems with throwing of the through holes, filling of the blind via holes and the like.
When Cu+-MPS accumulates the brightener concentration becomes too high, and the desired coating performance cannot be obtained.
If the oxygen concentration is too high, more MPS is oxidized by the oxygen, and less MPS is available for reducing the copper ions, detracting from the promoting effects so that the desired coating performance are not sufficiently obtained.
However, if many copper or other metal particles adhere to the filter for example, the dissolved oxygen in the plating solution may be expended by the metal particles, or additives (such as sulfur additives and the like) in the plating solution may be affected.

Method used

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  • Electrolytic plating equipment and electrolytic plating method
  • Electrolytic plating equipment and electrolytic plating method
  • Electrolytic plating equipment and electrolytic plating method

Examples

Experimental program
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first embodiment

[0033]As shown in FIG. 1, electrolytic plating equipment 11 of the first embodiment of the present invention is provided with plating tank 13, separate tank 15 apart from plating tank 13, source pipe 29 that sends plating solution from plating tank 13 to separate tank 15, and return pipe 41 that returns plating solution from separate tank 15 to plating tank 13.

[0034]Plating tank 13 has roughly rectangular, open-topped tank body 47 and overflow tank 49, which is integrated with tank body 47. Anodes 55 are arranged inside tank body 47. Tank body 47 is configured to allow insertion of cathode 57, which is the object to be plated.

[0035]Anodes 55 are arranged on both sides of cathode 57. Soluble anodes or insoluble anodes are used for anodes 55. In the case of soluble anodes, copper plates can be used for example. Spherical copper (copper balls) contained in a titanium or other mesh container can also be used for the soluble anodes. These copper plates or copper balls may be formed from ...

second embodiment

[0076]FIG. 4 shows separate tank 15 of electrolytic plating equipment 11 of the second embodiment of the present invention. In this second embodiment, the structure of first space 17 of separate tank 15 is different from that of the first embodiment. Components that are the same as in the first embodiment are indicated by the same symbols (reference numbers), and detailed explanations are omitted.

[0077]As shown in FIG. 4, separate tank 15 has second partition 35 in addition to separate tank body 20 and first partition 21. This second partition 35 is roughly rectangular, and extends vertically from the bottom of separate tank body 20. Second partition 35 divides the inside of first space 17 into two spaces. One space is supply space 33 to which plating solution is supplied from supply port 29a of source pipe 29, while the other space, located downstream from supply space 33, is settling space 31 for settling metal particles 32 from the plating solution.

[0078]Second partition 35 has m...

third embodiment

[0082]FIG. 5 shows separate tank 15 of electrolytic plating equipment 11 of the third embodiment of the present invention. In this third embodiment, the structure of first space 17 of separate tank 15 is different from those of the first and second embodiments. Constituent elements that are the same as in the first embodiment are indicated by the same symbols, and detailed explanations are omitted.

[0083]As shown in FIG. 5, separate tank 15 has second partition 35 in addition to separate tank body 20 and first partition 21. This second partition 35 is rectangular, and extends vertically from the bottom of separate tank body 20 as in the second embodiment above. Second partition 35 divides the inside of first space 17 into supply space 33 and settling space 31. The difference between this and the second embodiment is that second partition 35 of the third embodiment does not have multiple communicating holes.

[0084]In the third embodiment, upper edge 35a of second partition 35 is positi...

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Abstract

An electrolytic plating equipment includes: a plating tank for holding plating solution; and a separate tank apart from the plating tank, for holding the plating solution circulating between the plating tank and the separate tank. The separate tank contains a first space and a second space located downstream from the first space. The plating solution in the first space in an amount exceeding a specific height flows from the first space into the second space, and the plating solution falls through air in the second space.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to an electrolytic plating equipment and an electrolytic plating method.[0003]2. Background Art[0004]Electrolytic plating is used for forming wiring patterns on printed boards for example. In copper sulfate electrolytic plating for example, various additives including suppressors and promoters (called brighteners, carriers, levelers and the like) are added to the plating solution to obtain coating performance in terms of improved gloss, physical coating properties, throwing power, blind via hole filling and the like.[0005]Of these additives, suppressors work effectively on the board surface, while promoters work effectively in the through holes and blind via holes to promote throwing of the through holes and filling of the blind via holes. If there is too much promoter in the plating solution, however, the ability of the suppressor to suppress growth of active nuclei will be reduced, result...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D17/00C25D5/00
CPCC25D21/04C25D17/02C25D21/18C25D21/10C25D3/38
Inventor ISONO, TOSHIHISATACHIBANA, SHINJIOMURA, NAOYUKIHOSHI, SHUNSAKUMATSUDA, KANAKOSHIMIZU, KOJI
Owner C UYEMURA & CO LTD