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Snap-fit type heat sink module

a heat sink and clamping technology, applied in the direction of basic electric elements, semiconductor devices, lighting and heating apparatus, etc., can solve the problems of high heat produced by parts and components, stacking heat sinks cannot be used in other non-welding heat sink designs, and undesirable shutdown of computers, so as to save time and labor. , the effect of reducing the cost and quick connection

Inactive Publication Date: 2011-11-17
ASIA VITAL COMPONENTS SHENZHEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0008]A primary object of the present invention is to provide a snap-fit type heat sink module that can save time and labor needed to assemble the heat sink module.
[0009]Another object of the present invention is to provide a snap-fit type heat sink module that can be assembled without the need of welding.
[0010]To achieve the above and other objects, the snap-fit type heat sink module according to the present invention includes a heat sink and a snap-fit coupling member. The heat sink is formed with at least one receiving slot, which includes a first slot section sunken from one side surface of the heat sink and a second slot section extended from one side of the first slot section into the heat sink. The snap-fit coupling member includes a main body and at least one cantilever arm. The main body has a first surface and an opposite second surface; and the at least one cantilever arm includes a first arm section projected from the first surface for snap-fitting in the first slot section and a second arm section extended from an end of the first arm section distant from the first surface for engaging with the second slot section. The heat sink and the snap-fit coupling member can be quickly connected to each other at reduced cost by inserting the cantilever arm into the receiving slot without the need of welding.
[0011]Therefore, the present invention has the following advantages: (1) saving the time and labor needed to assemble the heat sink module; (2) enabling quick connection of the coupling member to the heat sink without the need of welding; and (3) meeting the requirement for environmental protection.

Problems solved by technology

As a result, a high amount of heat is produced by the parts and components in the electronic information products during the operation thereof.
When the heat produced by the CPU accumulates in the computer to exceed an allowable high limit, the accumulated heat would dangerously cause undesirable shutdown of the computer.
Therefore, the stack-fin heat sink could not be used in other non-welding heat sink designs because the latter do not include a base welded to the radiating fins to provide the positions for installing spring screws or push pins to assemble the heat sink to the CPU or a graphic processing unit (GPU) via the coupling member.
In brief, the conventional heat sinks have the following disadvantages: (1) requiring relatively high manufacturing cost; (2) requiring relatively long assembling time; (3) being restricted to a specific mounting manner; and (4) tending to cause the problem of environmental protection.

Method used

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Experimental program
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first embodiment

[0027]In the illustrated first embodiment, the heat sink 11 includes a plurality of sequentially stacked radiating fins 112, as can be seen in FIG. 2.

[0028]The snap-fit coupling member 12 includes a main body 121 and at least one cantilever arm 122. The main body 121 has a first surface 1211 and an opposite second surface 1212. The cantilever arm 122 includes a first arm section 1221 projected from the first surface 1211 for snap-fitting in the first slot section 1111, and a second arm section 1222 extended from an end of the first arm section 1221 distant from the first surface 1211 for engaging with the second slot section 1112.

[0029]In the first embodiment, the snap-fit coupling member 12 and the heat sink 11 are firmly connected to each other by snap-fitting the first arm section 1221 of the cantilever arm 122 of the coupling member 12 in the first slot section 1111 of the receiving slot 111 of the heat sink 11, so that the second arm section 1222 of the cantilever arm 122 hooks...

second embodiment

[0032]In the illustrated second embodiment, the heat sink 11 includes a plurality of sequentially stacked radiating fins 112, as can be seen in FIG. 4.

[0033]As can be seen in FIG. 4, the first slot section 1111 and the first groove 1113 are sunken into the heat sink 11 to be perpendicular to the side surface of the heat sink 11; and the second slot section 1112 is extended from an inner end of the first slot section 1111 at a right angle into the heat sink 11. The second slot section 1112 is communicable with the first slot section 1111 and the first groove 1113, as can be seen in FIGS. 3 and 4.

[0034]The snap-fit coupling member 12 includes a main body 121 and at least one cantilever arm 122. The main body 121 has a first surface 1211 and an opposite second surface 1212. The cantilever arm 122 includes a first arm section 1221 projected from the first surface 1211 for snap-fitting in the first slot section 1111, and a second arm section 1222 extended from an end of the first arm sec...

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PUM

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Abstract

A snap-fit type heat sink module includes a heat sink having at least one receiving slot, the receiving slot each including a first slot section sunken from one side surface of the heat sink and a second slot section extended from one side of the first slot section into the heat sink; and a snap-fit coupling member including a main body having a first surface and an opposite second surface, and at least one cantilever arm including a first arm section projected from the first surface for snap-fitting in the first slot section, and a second arm section extended from an end of the first arm section distant from the first surface for engaging with the second slot section. The heat sink and the coupling member can be quickly connected to each other at reduced cost by snap-fitting the cantilever arm in the receiving slot without the need of welding.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a snap-fit type heat sink module, and more particularly to a snap-fit type heat sink module having a heat sink and a coupling member snap-fitted to the heat sink.BACKGROUND OF THE INVENTION[0002]Various kinds of electronic information products, such as computers, have been widely employed by more and more people in their daily life and can be applied in more different applications now. Due to the large demands in the market, all the electronic information products developed by the currently available electronic information techniques have largely increased computing speed and access capacity. As a result, a high amount of heat is produced by the parts and components in the electronic information products during the operation thereof.[0003]For example, the central processing unit (CPU) in a computer produces the largest part of heat in the computer. When the heat produced by the CPU accumulates in the computer to exceed an ...

Claims

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Application Information

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IPC IPC(8): F28F7/00
CPCF28F3/06H01L23/4093H01L2924/0002H01L2924/00
Inventor LAI, CHUN-PO
Owner ASIA VITAL COMPONENTS SHENZHEN CO LTD