Heat-conducting module and heat-dissipating device having the same

Abstract

A heat-conducting module for heat conduction of an electronic heat-generating element includes a heat pipe and a vapor chamber. The vapor chamber has an evaporating section brought into thermal contact with the electronic heat-generating element and a heat-conducting section located away from the evaporating section and wrapping around the heat pipe. With this arrangement, the contact area and heat-conducting efficiency between the vapor chamber and the heat pipe can be increased greatly, thereby obtaining a heat-conducting module with an excellent heat-conducting efficiency. With a heat-dissipating fin assembly and a fan being connected to the heat pipe, a heat-dissipating device having the aforesaid heat-conducting module can be obtained, whereby the heat of the vapor chamber and the heat pipe can be rapidly dissipated to the outside.

Description

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AI Technical Summary

Benefits of technology

The heat-conducting module and heat-dissipating device described in this patent have a vapor chamber that increases the contact area between the vapor chamber and the heat pipe, thereby improving heat conduction. The vapor chamber has an evaporating section in thermal contact with the electronic heat-generating element and a heat-conducting section located away from the evaporating section and wrapping around the heat pipe. This wrapped heat-conducting section can increase the contact area between the vapor chamber and the heat pipe, allowing for faster heat dissipation to the outside. The heat-dissipating fin assembly connected to the heat-releasing section of the heat pipe can further enhance the heat dissipation process.

Problems solved by technology

The technical problem addressed in this patent is the need for effective heat-conducting members to prevent the accumulation of heat inside electronic elements, which can affect their performance and even cause damage. The patent discusses the use of vapor chambers and heat pipes, which are commonly used for this purpose, and proposes a solution to increase the contact surface area between them to improve heat-conducting efficiency. However, current solutions require a thicker vapor chamber, which does not conform to requirements for compact design. The present inventor aims to address this problem and improve the heat-conducting efficiency between the vapor chamber and heat pipe.

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