Cooling device

Inactive Publication Date: 2012-05-03
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the generated heat is not quickly removed, the CPU can overheat, and the workability and stability of the CPU may be adversely affected.
Conventional cooling devices are sufficient for CPUs running at average operating frequencies, but are liable to be unsatisfactory for cooling CPUs operating at high frequencies.
However, a wall of the liquid flow channel has a relatively small heat exchan

Method used

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Examples

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Embodiment Construction

[0013]Reference will now be made to the figures to describe the present cooling device in detail.

[0014]Referring to FIG. 1, a cooling device 100 according to an exemplary embodiment of the present disclosure includes a heat dissipation member 20, a heat absorbing member 30, a pump 40, and a liquid input conduit 60 and a liquid output conduit 70 connecting the heat dissipating member 20, the heat absorbing member 30, and the pump 40 in a loop.

[0015]The heat absorbing member 30 thermally contacts a heat generating component 80 (see FIG. 4), such as a CPU, for absorbing heat generated therefrom. Referring also to FIGS. 2 and 3 together, the heat absorbing member 30 includes a bottom plate 31, a fin unit 32, a sealing ring 33, a cover 34 and three connecting units 35.

[0016]The bottom plate 31 is made of thermally conductive material, such as copper or aluminum. The cover 34 includes a substantially circular top plate 341, a side plate 342 depending from an outer periphery of the top pla...

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PUM

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Abstract

An exemplary cooling device includes a heat dissipating member, a pump, a heat absorbing member defining a receiving chamber containing coolant therein, and a liquid input conduit and a liquid output conduit connecting the heat absorbing member, the heat dissipation member and the pump together to form a heat transfer loop. The heat absorbing member have at a first side and a second side opposite to the first side. The heat absorbing member defines a heating area at the first side. The heating area is configured to contact a heat generating component for absorbing heat generated by the heat generating component. The heat absorbing member includes at the second side a liquid inlet aligned with the heating area and liquid outlets around the liquid inlet.

Description

BACKGROUND[0001]1. Technical Field[0002]The disclosure generally relates to temperature control of operating electronic devices, and more particularly to a cooling device for a heat generating electronic component such as a central processing unit (CPU).[0003]2. Description of Related Art[0004]As a result of the higher operating frequencies and faster speed of modern CPUs, heat generated by these CPUs during their operation is commensurately higher. If the generated heat is not quickly removed, the CPU can overheat, and the workability and stability of the CPU may be adversely affected.[0005]In order to remove heat from CPUs, cooling devices are often provided. A heat sink combined with an electric fan is typically used, and this arrangement can achieve good heat dissipation. Conventional cooling devices are sufficient for CPUs running at average operating frequencies, but are liable to be unsatisfactory for cooling CPUs operating at high frequencies.[0006]Various kinds of cooling d...

Claims

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Application Information

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IPC IPC(8): F28D15/00
CPCH01L23/473G06F1/20G06F2200/201H01L2924/0002H01L2924/00
Inventor TANG, XIAN-XIU
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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