Heat dissipation device with heat pipe

Abstract

An exemplary heat dissipation device includes a heat pipe and a fin assembly. The heat pipe includes a main body and an end portion. The end portion has a width smaller than that of the main body. The fin assembly includes a first fin and a second fin adjoining to the first fin. The first fin forms a flange from a side of thereof. The second fin forms a flange from a side of thereof. The flange of the first fin has an extending portion overlapping and soldering to the flange of the second fin. The extending portion defines a number of through holes corresponding to the flange of the second fin. The end portion of the heat pipe is soldered to the extending portion of the first fin and soldered to the flange of the second fin by the through holes of the extending portion.

Description

BACKGROUND[0001]1. Technical Field[0002]The disclosure relates to heat dissipation devices in electronics, and more particularly to a heat dissipation device with a heat pipe.[0003]2. Description of Related Art[0004]During operation of an electronic device such as a computer central processing unit (CPU), a large amount of heat is often produced. The heat must be quickly removed from the CPU to prevent it from becoming unstable or being damaged. Typically, a heat dissipation device is attached to an outer surface of the CPU to absorb the heat from the CPU.[0005]Conventionally, a heat dissipation device in a limited space includes a solid metal base attached to the CPU, a heat pipe connected to the base, and a plurality of fins soldered to the heat pipe. However, ends of the heat pipe are shrunk to form a sealed structure. The outermost fins are difficult to be soldered to the shrunk ends of the heat pipe, which results in easily dropping of the outmost fins from the heat dissipation...

AI Technical Summary

Benefits of technology

[0005]Conventionally, a heat dissipation device in a limited space includes a solid metal base attached to the CPU, a heat pipe connected to the base, and a plurality of fins soldered to the heat pipe. However, ends of the heat pipe are shrunk to form a sealed structure. The outermost fins are difficult to be soldered to the shrunk ends of the heat pipe, which results in easily dropping of the outmost fins from the heat dissipation device and harming peripheral devices, such as the CPU.

Problems solved by technology

During operation of an electronic device such as a computer central processing unit (CPU), a large amount of heat is often produced.

However, ends of the heat pipe are shrunk to form a sealed structure.

The outermost fins are difficult to be soldered to the shrunk ends of the heat pipe, which results in easily dropping of the outmost fins from the heat dissipation device and harming peripheral devices, such as the CPU.

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