Nonvolatile resistive memory element with an integrated oxygen isolation structure

a technology of oxygen isolation structure and resistive memory element, which is applied in the direction of bulk negative resistance effect device, electrical apparatus, semiconductor device, etc., can solve the problems of affecting the performance and longevity of the memory element, scaling issues, and challenges of traditional nonvolatile memory technology

Inactive Publication Date: 2013-08-29
INTERMOLECULAR
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, as device dimensions shrink, scaling issues pose challenges for traditional nonvolatile memory technology.
However, such bistable memory elements are more sensitive to oxygen migration during fabrication and / or operation, since the migration of even a very small number of mobile oxygen ions into such memory elements can significantly alter the performance and longevity of the memory element.

Method used

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  • Nonvolatile resistive memory element with an integrated oxygen isolation structure
  • Nonvolatile resistive memory element with an integrated oxygen isolation structure
  • Nonvolatile resistive memory element with an integrated oxygen isolation structure

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Embodiment Construction

[0024]Embodiments of the invention set forth a nonvolatile resistive memory device having one or more novel oxygen isolation structures and methods of forming the same. One such oxygen isolation structure may be an oxygen barrier layer that isolates the resistive switching material of the nonvolatile memory element from other portions of the resistive memory device during fabrication and / or operation of the memory device. Specifically, the oxygen barrier layer encapsulates the regions of one or of the memory elements to prevent the depletion of oxygen vacancies from such element. Another such oxygen isolation structure may be a sacrificial layer that reacts with unwanted oxygen migrating toward a memory element of the resistive memory device during fabrication and / or operation of the memory device. The sacrificial layer comprises a material that reacts with oxygen present in the memory element in order to maintain or increase the oxygen vacancies in such element. Use of the oxygen b...

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Abstract

A nonvolatile resistive memory element includes one or more novel oxygen isolation structures that protect the resistive switching material of the memory element from oxygen migration. One such oxygen isolation structure comprises an oxygen barrier layer that isolates the resistive switching material from other portions of the resistive memory device during fabrication and / or operation of the memory device. Another such oxygen isolation structure comprises a sacrificial layer that reacts with unwanted oxygen migrating toward the resistive switching material during fabrication and / or operation of the memory device.

Description

BACKGROUND[0001]1. Field of the Invention[0002]This invention relates to nonvolatile resistive memory elements, and more particularly, to a nonvolatile resistive memory element with an integrated oxygen isolation structure and methods for forming the same.[0003]2. Description of the Related Art[0004]Nonvolatile memory elements are used in devices requiring persistent data storage, such as digital cameras and digital music players, as well as in computer systems. Electrically-erasable programmable read only memory (EPROM) and NAND flash are nonvolatile memory technologies currently in use. However, as device dimensions shrink, scaling issues pose challenges for traditional nonvolatile memory technology. This has led to the investigation of alternative nonvolatile memory technologies, including resistive switching nonvolatile memory.[0005]Resistive switching nonvolatile memory is formed using memory elements that are bistable, i.e., having two stable states with different resistances....

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L45/00
CPCH01L45/10H01L45/12H01L45/1233H01L45/16H01L45/1675H01L27/2463H01L45/146H10B63/80H10N70/801H10N70/24H10N70/826H10N70/8833H10N70/063H10B53/30H10N70/011H10N70/25
Inventor WANG, YUNCHIANG, TONY P.HASHIM, IMRANPRAMANIK, DIPANKAR
Owner INTERMOLECULAR
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