Light emitting element package and method of manufacturing the same

a technology of light emitting elements and light emitting elements, which is applied in the direction of basic electric elements, electrical apparatus, semiconductor devices, etc., can solve the problems of reducing the size reducing the reliability of the light emitting element package, and limiting the degree of freedom available in the design of illumination devices, etc., to maximize the degree of freedom
US20130240934A1Inactive Publication Date: 2013-09-19SAMSUNG ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
SAMSUNG ELECTRONICS CO LTD
Publication Date
2013-09-19
Estimated Expiration
Not applicable · inactive patent

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Abstract

There is provided a light emitting element package including: a light emitting laminate having a structure in which semiconductor layers are laminated and having a first main surface and a second main surface opposing the first main surface; a terminal unit disposed on an electrode disposed on the second main surface; a molded unit disposed on the second main surface of the light emitting laminate and allowing a portion of the terminal unit to be exposed; and a wavelength conversion unit disposed on the first main surface of the light emitting laminate.
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Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the priority of Korean Patent Application No. 10-2012-0026068 filed on Mar. 14, 2012, and No. 10-2013-0000946 on Jan. 4, 2013 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference.BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The inventive concept relates to a light emitting element package and a method of manufacturing the same.

[0004] 2. Description of the Related Art

[0005] A light emitting diode (LED) is a type of a luminous element (or light emitting element) capable of implementing light in various colors by forming a light emission source through a PN junction in a compound semiconductor.

[0006] The uses of LEDs have extended from a signal light to general illumination devices, and in order to emit a larger quantity of light, LEDs have tended to have enhanced light efficiency and larger sizes. Meanwhile, as the general purposes of LEDs have extend...

Claims

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