Light emitting element package and method of manufacturing the same

Abstract

There is provided a light emitting element package including: a light emitting laminate having a structure in which semiconductor layers are laminated and having a first main surface and a second main surface opposing the first main surface; a terminal unit disposed on an electrode disposed on the second main surface; a molded unit disposed on the second main surface of the light emitting laminate and allowing a portion of the terminal unit to be exposed; and a wavelength conversion unit disposed on the first main surface of the light emitting laminate.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims the priority of Korean Patent Application No. 10-2012-0026068 filed on Mar. 14, 2012, and No. 10-2013-0000946 on Jan. 4, 2013 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The inventive concept relates to a light emitting element package and a method of manufacturing the same.[0004]2. Description of the Related Art[0005]A light emitting diode (LED) is a type of a luminous element (or light emitting element) capable of implementing light in various colors by forming a light emission source through a PN junction in a compound semiconductor.[0006]The uses of LEDs have extended from a signal light to general illumination devices, and in order to emit a larger quantity of light, LEDs have tended to have enhanced light efficiency and larger sizes. Meanwhile, as the general purposes of LEDs have extend...

AI Technical Summary

Benefits of technology

The patent text describes a need for a light emitting element package that can effectively dissipate heat and reduce production costs. The package should be mounted directly on a wiring pattern, rather than a circuit board, to simplify heat transmission. The structure of the package should also be simplified to enhance productivity.

Problems solved by technology

However, in case of a premolded structure such as a conventional light emitting element package structure in which an LED is attached to a package body or in the case of a package structure in which an LED chip is attached to a ceramic substrate, or the like, there is a limitation in reducing a size, resulting in a limitation in a degree of freedom available in the designing of an illumination device.

Here, heat generated by the light emitting element is dissipated outwardly through the circuit board, and in this case, if heat generated by the light emitting element is not smoothly dissipated outwardly, reliability of the light emitting element package may be degraded, or the like.

Images