Heat dissipaion device and thermal module using same
a heat dissipation device and thermal module technology, applied in the direction of basic electric elements, semiconductor devices, lighting and heating apparatus, etc., can solve the problems of inability to effectively prevent the leakage of cooling fluid at the joints between the tubes and the water block, undesirably damage the electronic device, etc., to prolong the service life of the thermal module and prevent the effect of cooling fluid leakag
Inactive Publication Date: 2014-03-13
ASIA VITAL COMPONENTS SHENZHEN CO LTD
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- Description
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- Application Information
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Benefits of technology
The present invention is designed to prevent cooling fluid from leaking out of a heat dissipation device and a thermal module, which results in a longer service life of the thermal module.
Problems solved by technology
However, the use of the heat sink and the radiating fins to radiate heat can only provide very limited heat dissipation effect.
While the liquid-cooling thermal module can provide upgraded heat dissipation effect, the cooling fluid tends to leak at joints between the tubes and the water block, the water tank unit, the pump and the heat exchanger.
Since the liquid-cooling thermal module is in direct contact with the heat sources and electronic elements in an electronic device, the cooling fluid leaked out of the thermal module would undesirably damage the electronic device.
Method used
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[0020]The present invention will now be described with some preferred embodiments thereof and with reference to the accompanying drawings. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.
[0021]Please refer to FIGS. 1 and 2 that are exploded perspective view and assembled sectional view, respectively, of a first embodiment of a heat dissipation device 1 according to the present invention. As shown, the heat dissipation device 1 in the first embodiment thereof includes at least one water block 11, a heat exchanger 12, a first metal tube 13, and a second metal tube 14.
[0022]The water block 11 internally defines a first receiving space 111 and is provided with a first inlet 112 and a first outlet 113, both of which are communicable with the first receiving space 111. The water block 11 is made of a material with good heat conducting ability. At least one side of the water block 11 is a heat-absorbi...
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A heat dissipation device and a thermal module using same are disclosed. The heat dissipation device includes at least one water block, a heat exchanger, a first metal tube and a second metal tube, and the water block and the heat exchanger are connected to one another by the first and second metal tubes. The thermal module includes, in addition to the heat dissipation device, a pump unit connected to the heat exchanger of the heat dissipation device, and a cooling fluid filled in the heat dissipation device and the pump unit. By connecting the water block to the heat exchanger via the first and second metal tubes, it is able to effectively prevent the problem of cooling fluid leakage.
Description
FIELD OF THE INVENTION[0001]The present invention relates to a heat dissipation device, and more particularly to a heat dissipation device that eliminates the problem of cooling fluid leakage. The present invention also relates to a thermal module using the above-described heat dissipation device.BACKGROUND OF THE INVENTION[0002]While the currently available various electronic devices have constantly enhanced computing power, the heat produced by their internal electronic elements during operation also increases. Usually, a heat sink or a plurality of radiating fins are attached to the electronic elements to provide increased heat dissipation surface area and upgraded heat dissipation effect. However, the use of the heat sink and the radiating fins to radiate heat can only provide very limited heat dissipation effect. Thus, liquid-cooling thermal modules are also employed in an attempt to provide enhanced heat dissipation effect.[0003]A liquid-cooling thermal module uses a cooling f...
Claims
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IPC IPC(8): F28D15/00
CPCF28D15/00F28D2021/0031H01L23/473H01L2924/0002H01L2924/00
Inventor CHIU, TZU-CHIN
Owner ASIA VITAL COMPONENTS SHENZHEN CO LTD