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Heat dissipation module

a technology of heat dissipation module and heat dissipation chamber, which is applied in the direction of air heaters, lighting and heating apparatus, instruments, etc., can solve the problems of unsuitable heat dissipation module space and large space occupied by heat dissipation modul

Inactive Publication Date: 2014-07-03
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent text discusses a computer that has components that generate heat during use. The computer has a heat dissipation module to remove the heat outside. The module consists of a heat sink and a fan. However, this module takes up too much space, which is not suitable for small-sized computers. The technical effect of this patent text is to provide a heat dissipation module that is effective without taking up too much space in small-sized computers.

Problems solved by technology

However, the heat dissipation module occupies much space which is not suitable in a small-sized computer, such as a notebook computer or a tablet.

Method used

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Embodiment Construction

[0010]The disclosure is illustrated by way of example and not by way of limitation. In the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean “at least one.”

[0011]FIGS. 1 and 2 show an embodiment of a heat dissipation module. The heat dissipation module includes a heat dissipation piece 10, a base plate 20, a circuit board 30, a bearing 40, a mounting member 50, a fan impeller 60, and a housing 70.

[0012]The heat dissipation piece 10 has a circular, serrated shape. The heat dissipation piece 10 is made from metal material having good heat transfer ability. The heat dissipation piece 10 can directly touch a heat generating component for dissipating heat generated by the heat generating component.

[0013]A mounting opening 22 is defined in the base plate 20 for mounting the heat dissipation piece 10. A...

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Abstract

A heat dissipation module includes an encasing structure, a fan impeller mounted in the encasing structure, a heat dissipation piece, and a bearing. The fan impeller includes a mounting post and a plurality of fan blades surrounding the post. The heat dissipation piece is mounted in a base plate of the encasing structure and configured for directly contacting with a heat generating component. The bearing is mounted on the heat dissipation piece. The mounting post is pivotably mounted in the bearing. The fan impeller is capable of dissipating heat generated by the heat generating component when the mounting post is rotating in the bearing.

Description

BACKGROUND[0001]1. Technical Field[0002]The present disclosure relates to a heat dissipation module.[0003]2. Description of Related Art[0004]A computer includes a plurality of heat generating components which generate heat during operation. A heat dissipation module is utilized to dissipate heat generated by the plurality of heat generating components to the outside of the computer. The heat dissipation module includes a heat sink apparatus and a fan mounted on the heat sink apparatus. The heat dissipation module should possess good heat dissipation ability. However, the heat dissipation module occupies much space which is not suitable in a small-sized computer, such as a notebook computer or a tablet.[0005]Therefore, there is room for improvement within the art.BRIEF DESCRIPTION OF THE DRAWINGS[0006]Many aspects of the embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instea...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20409G06F1/203
Inventor ZENG, XIANG-KUNSHI, BAO-QUAN
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD