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Flip chip package and manufacturing method thereof

a chip and chip technology, applied in the field of flip chip packages, can solve the problems of air trapped in the filler, more flow of the filler,

Inactive Publication Date: 2016-02-25
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention is about a new way to make flip chip packages that helps to prevent a void between the chips. The new method involves removing a layer of solder resist between the chips to allow the under-fill material to flow faster. This results in faster and more complete filling of the gap between the chips, leading to better performance and reliability.

Problems solved by technology

When filling with the filler, the lower the height of the semiconductor chip on the substrate and the narrower the gap between the solder bumps, the filler is flowed in more unevenly, thereby possibly causing a void in which air is trapped in the filler.

Method used

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  • Flip chip package and manufacturing method thereof
  • Flip chip package and manufacturing method thereof
  • Flip chip package and manufacturing method thereof

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Embodiment Construction

[0025]Hereinafter, certain embodiments of a flip chip package and a manufacturing method thereof in accordance with the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention with reference to the accompanying drawings, any identical or corresponding elements will be assigned with same reference numerals, and no redundant description thereof will be provided.

[0026]Terms such as “first” and “second” can be used in merely distinguishing one element from other identical or corresponding elements, but the above elements shall not be restricted to the above terms.

[0027]When one element is described to be “coupled” to another element, it does not refer to a physical, direct contact between these elements only, but it shall also include the possibility of yet another element being interposed between these elements and each of these elements being in contact with said yet another element.

[0028]FIG. 1 is a plan view show...

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Abstract

A flip chip package and a manufacturing method thereof are disclosed. The flip chip package in accordance with an embodiment of the present invention includes: a substrate; a plurality of pads formed on the substrate; a solder resist covering the substrate in such a way that the pads are exposed; a chip mounted on the substrate in such a way that the chip is electrically connected with the pads; a plurality of bumps formed, respectively, on the pads in such a way that the bumps are interposed between the pads and the chip; an under-fill flowing between the substrate and the chip and being filled in between the substrate and the chip; and an opening placed in between the plurality of bumps in such a way that a flowing space of the under-fill is provided in between the plurality of bumps.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims the benefit of Korean Patent Application No. 10-2014-0108376, filed with the Korean Intellectual Property Office on Aug. 20, 2014, the disclosure of which is incorporated herein by reference in its entirety.BACKGROUND[0002]1. Technical Field[0003]The present invention relates to a flip chip package and a method of manufacturing the same.[0004]2. Background Art[0005]With the sharp increase in the demand for mobile electronic products, the components installed in the electronic products need to be increasingly smaller and lighter. Used for smaller and lighter components in semiconductor packages has been a flip chip process.[0006]In the flip chip process, a filler is interposed between a semiconductor chip and a substrate. The filler mitigates the difference in the coefficient of thermal expansion between the semiconductor chip and the substrate and protects solder bumps, enhancing the reliability of the semiconducto...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L23/00H01L21/48H01L21/56H01L23/31H01L23/498
CPCH01L24/17H01L23/3142H01L24/81H01L2224/81191H01L21/4846H01L23/49838H01L2224/16227H01L21/563H01L23/49827H01L23/50H01L2224/11013H01L2224/16225H01L2224/32225H01L2224/73204H01L2224/92125H01L2224/16237H01L24/14H01L24/13H01L24/32H01L2224/2919H01L24/16H01L24/92H01L24/73H01L2224/13101H01L2224/81007H01L2924/00H01L2924/014H01L2924/00014H01L2924/0665H01L21/4853H01L23/3185H01L23/49811H01L2021/60022
Inventor HONG, SEOK-YOON
Owner SAMSUNG ELECTRO MECHANICS CO LTD