Electronic component module

Active Publication Date: 2016-10-13
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patent describes a new structure for an electronic component module that eliminates the need for separate interposers and printed circuit boards, reducing cost and size. The wiring layer serves as both an electrical connection and a reinforcement for the cover layer, preventing bending and ensuring high connection reliability. The patterning of the wiring layer is precise, allowing for high mounting density and further reducing the size of the module. This structure also reduces thermal stress concentration on the connection points between the electronic component and the wiring layer, improving device performance. Additionally, it reduces the distance between the radio frequency switch and the radio frequency filter, leading to better device characteristics and reducing the number of external terminals.

Problems solved by technology

This may cause an increase in size of the front-end module.

Method used

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first preferred embodiment

[0039]An electronic component module according to a first preferred embodiment of the present invention will be described. The description is provided by using a front-end circuit component as the electronic component module. The front-end circuit component 10 is connected to an antenna and transmission and reception devices and demultiplexes transmission and reception signals in accordance with a used frequency band. The front-end circuit component 10 is preferably used for a wireless communication device operating, for example, in a multiband and a multimode.

[0040]FIG. 1 is a schematic cross-sectional diagram of the front-end circuit component 10. The front-end circuit component includes a base-body elastic wave filter 11, a RF (Radio Frequency) switch 32, an elastic wave filter 33, and a chip inductor 34. The RF switch 32 corresponds to a radio frequency switch of a preferred embodiment of the present invention. The elastic wave filter 33 corresponds to a second elastic wave filt...

second preferred embodiment

[0078]A front-end circuit component 60 according to a second preferred embodiment of the present invention will be described. FIG. 9 is a schematic cross-sectional diagram of the front-end circuit component 60. The front-end circuit component 60 includes a base-body elastic wave filter 61 instead of the base-body elastic wave filter 11 according to the first preferred embodiment. The base-body elastic wave filter 61 includes the IDT electrodes 13, the first wiring layers 14, piezoelectric substrates 62, a substrate 63, a supporting layer 65, a cover layer 66, solders 68, the second wiring layer 19, and second wiring layers 69.

[0079]A plurality of piezoelectric substrates 62 are provided on an upper surface of the substrate 63. Each IDT electrode 13 and each first wiring layer 14 are provided on an upper surface of a corresponding one of the piezoelectric substrates 62. The first wiring layer 14 is connected to a corresponding one of the IDT electrodes 13. A SiO2 protection film (not...

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Abstract

A front-end circuit component includes a base-body elastic wave filter and a mounted electronic component. The base-body elastic wave filter includes a piezoelectric substrate and an IDT electrode on an upper surface of a piezoelectric substrate. The mounted electronic component is mounted above the piezoelectric substrate to define a sealed space in which the IDT electrode is disposed.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]This application claims the benefit of priority to Japanese Patent Application 2013-267367 filed Dec. 25, 2013 and is a Continuation application of PCT / JP2014 / 083826 filed on Dec. 22, 2014. The entire content of each application are hereby incorporated by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to an electronic component module supporting a plurality of frequency bands.[0004]2. Description of the Related Art[0005]An example of an electronic component module of a front end incorporated in a mobile terminal such as a wireless communication device includes a front-end module described in Japanese Unexamined Patent Application Publication No. 2003-249868. The front-end module includes as chip components a diplexer, a low pass filter, and the like, and the chip components are mounted on a resin multilayer substrate. Active elements included in switches are also mounted on the resi...

Claims

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Application Information

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IPC IPC(8): H03H9/54H04L5/14H03H9/64H04B1/00
CPCH03H9/542H03H9/64H04L5/1461H04B1/0057H04B1/006H03H9/1085H03H9/725H03H9/0566H03H9/0547H03H2009/0019H03H9/0552H10N30/071H10N30/88H10N30/875
InventorIWAMOTO, TAKASHI
OwnerMURATA MFG CO LTD