Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Heat radiation device

a heat radiation device and heat dissipation fin technology, which is applied in the direction of lighting and heating apparatus, modifications by conduction heat transfer, and semiconductor/solid-state device details, etc., can solve the problems of inability to use, inability to provide heat dissipation fins b>12/b> provided on electronic devices, such as antenna devices, to be installed in the direction of gravitational force, etc., to achieve the effect of increasing the degree of air flow

Inactive Publication Date: 2017-04-06
KMW INC
View PDF9 Cites 15 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a heat dissipation device that can increase the air flow flow regardless of the installation position. Additionally, the device has no limitations in installation position and maintains consistent heat dissipation efficiency regardless of the direction of installation.

Problems solved by technology

If the high-temperature heat generated by the heat radiating modules is not effectively released, the heat may affect peripheral components, as well as the corresponding heat radiating modules, to cause malfunctions and damages to the components, and the electronic devices may not be able to perform their functions and in severe cases, may not be able to be used due to the damage to the components.
However, the heat dissipation fins 12 provided on an electronic device, such as an antenna device, may not be installed in the direction of the gravitational force on account of variables, such as installation place, space, etc.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat radiation device
  • Heat radiation device
  • Heat radiation device

Examples

Experimental program
Comparison scheme
Effect test

first embodiment

[0064]Hereinafter, the heat dissipation device 100, according to the present invention, will be described with reference to FIGS. 2 and 3.

[0065]Referring to FIGS. 2 and 3, the heat dissipation device 100, according to the first embodiment, may include inset portions 140 crossing each other and four heat dissipation areas 131, 132, 133, and 134 divided from each other with respect to the inset portions 140. Specifically, the heat dissipation device 100 may include: the inset portions 140 formed on a square plate 110 in a horizontal direction and in the direction perpendicular to the horizontal direction to cross each other in the shape of “+”; and the first to fourth heat dissipation areas 131, 132, 133, and 134 divided from each other with respect to the inset portions 140. In the present invention, based on FIG. 3, the upper left heat dissipation area may be referred to as the first heat dissipation area 131, the upper right heat dissipation area in the clockwise direction may be r...

second embodiment

[0074]Hereinafter, the heat dissipation device 100, will be described with reference to FIGS. 4 and 5.

[0075]The heat dissipation device 100 according to the second embodiment of the present invention differs from the heat dissipation device 100 according to the first embodiment described above in terms of the angles of first to fourth heat dissipation fins 121, 122, 123, and 124 formed in first to fourth heat dissipation areas 131, 132, 133, and 134. Accordingly, in describing the second embodiment of the present invention, the preceding embodiment may be applied to contents or configurations identical with those described above. Furthermore, the following description will be focused on a difference therebetween while the preceding embodiment is applied to contents identical with those described above.

[0076]Referring to FIGS. 4 and 5, the heat dissipation device 100, according to the second embodiment, may include inset portions 140 crossing each other in the shape of “+” on a plat...

third embodiment

[0080]Hereinafter, the heat dissipation device 100, will be described with reference to FIGS. 6 and 7.

[0081]The heat dissipation device 100 according to the third embodiment of the present invention differs from the heat dissipation device 100 according to the first or second embodiment described above in terms of the shape in which a plate 110 is installed, the shape in which inset portions cross each other, and the angles by which first to fourth heat dissipation fins 121, 122, 123, and 124 are formed in first to fourth heat dissipation areas 131, 132, 133, and 134.

[0082]Referring to FIGS. 6 and 7, in the heat dissipation device 100, according to the third embodiment of the present invention, the inset portions 140 may be formed on the square plate 110 to connect corners of the square plate and to cross each other. Namely, the inset portions 140 formed of two inset lines may be formed on the plate 110 to cross each other in the shape of “X.”

[0083]The plate 110 may be divided into...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
angleaaaaaaaaaa
angleaaaaaaaaaa
anglesaaaaaaaaaa
Login to View More

Abstract

Heat radiation devices according to various embodiments of the present invention may comprise: a heating plate; and a heat radiating area portion which is provided in the heating plate and has heat radiation pins having angles different from each other. Also, other various embodiments are possible.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]This application is a continuation of an International Application No. PCT / KR2015 / 006216 filed on Jun. 18, 2015, which claims priority to Korean Patent Application No. 10-2014-0074424 filed on Jun. 18, 2014, the entire disclosures of which are incorporated herein by reference.TECHNICAL FIELD[0002]The present invention relates to a heat dissipation device and, for example, to a heat dissipation device having heat dissipation fins oriented in different directions.BACKGROUND ART[0003]Recently, various types of electronic devices have been provided for users. As a variety of functions are integrated in electronic devices, components (hereinafter, referred to as “the heat radiating modules”) to generate high-temperature heat may be provided in the electronic devices.[0004]If the high-temperature heat generated by the heat radiating modules is not effectively released, the heat may affect peripheral components, as well as the corresponding heat...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): F28F3/04F28F13/12
CPCF28F13/12F28F3/04F28F3/048F28F2215/04H01L23/3672B29C70/885F28F7/00H05K7/20H05K7/2039H05K7/20409H05K7/20854
Inventor YOO, CHANG-WOOPARK, MIN-SIKMUN, SO-HYEONKIM, HYE-YEON
Owner KMW INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com