Thermal management of optical coupling systems

Abstract

An optical coupling system includes a substrate, an electronic die comprising a plurality of coupling holes for passing light, an optical element die attached to a bottom surface of the electronic die, the electronic die attached to the substrate such that the electronic die covers a cavity in the substrate and the optical element die resides within the cavity of the substrate. The system may also include a thermally conductive lid that covers and contacts the electronic die and the substrate and has a coupling aperture that enables light that passes through the coupling holes to pass through the thermally conductive lid. The system may also include an optical cable coupler comprising a coupling section that laterally fits within the coupling aperture and a body section disposed above the coupling section that is laterally larger than the coupling section. A method for providing the above system is also disclosed herein.

Description

GOVERNMENT RIGHTS[0001]This invention was made with government support under contract number H98230-13-D-0122 awarded by the United States Department of Defense. The United States Government has certain rights to this invention.BACKGROUND OF THE INVENTION[0002]The present invention relates generally to the field of optical coupling systems, and more particularly to thermal management in optical coupling systems.[0003]Active optical elements such as electro-optic transceivers often produce substantial thermal loads and are usually optically coupled to large optical connectors which hinder access to cooling elements such as heat sinks. Furthermore, the optical coupling pathways between the active optical elements and the optical connectors comprise materials that are thermally insulating and reduce the ability to cool the active optical elements. Additionally, the continued increase in channels carried on optical fibers along with the potential for multicore fiber applications increas...

AI Technical Summary

Benefits of technology

The optical coupling system described in this patent allows for the efficient coupling of optical elements to electronic components. The system includes an electronic die with coupling holes and an optical element die attached to the bottom of the electronic die, which resides within a cavity in a substrate. A thermally conductive lid covers the electronic die and substrate and includes a coupling aperture that allows light to pass through. An optical cable coupler is then connected to the optical elements, which fit snugly within the coupling aperture. The technical effects of this system include improved optical coupling, reduced power consumption, and improved performance.

Problems solved by technology

Active optical elements such as electro-optic transceivers often produce substantial thermal loads and are usually optically coupled to large optical connectors which hinder access to cooling elements such as heat sinks.

Furthermore, the optical coupling pathways between the active optical elements and the optical connectors comprise materials that are thermally insulating and reduce the ability to cool the active optical elements.

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