Method for packaging thermoelectric module

a technology of thermoelectric modules and packaging methods, applied in the manufacture/treatment of thermoelectric devices, the details of thermoelectric devices, and the like, can solve the problems of degrading the performance of thermoelectric power generation, electrical shorting, and the thermoelectric module may significantly affect the output, so as to avoid electrical shorting, prevent chemical changes, and avoid oxidation.

Active Publication Date: 2018-01-11
HYUNDAI MOTOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0014]Various aspects of the present invention are directed to providing a method for packaging a thermoelectric module, which can effectively prevent an oxidation reaction, chemical changes, and the like that may be caused by external factors, avoid electrical shorting that may be caused by moist, conducting liquid, or the like, and protect individual elements of the thermoelectric module from stress, strain, shear force, and the like, due to external physical factors.

Problems solved by technology

Here, a heat transfer rate from a heat source to the thermoelectric module may significantly affect the output.
Meanwhile, when the thermoelectric elements and / or the electrodes of the thermoelectric module come into contact with the outside air under a high temperature environment, they may be oxidized or chemically changed, which may degrade thermoelectric power generation performance.
When moist or conducting liquid (water or the like) contacts the thermoelectric elements and / or the electrodes, it may cause electrical shorting.
In addition, when impacts or shocks may occur due to external physical factors, stress, strain, shear force or the like may cause damages to the thermoelectric module.
In a conventional packaging technique, however, heat transfer may easily occur along sidewalls of the metallic housing, resulting in severe heat loss.
Accordingly, it is difficult to secure a temperature difference between the high temperature side and the low temperature side, which may degrade thermoelectric power generation performance.
In addition, when the thermoelectric module is exposed to a heat source for a long time or is subjected to repeated temperature changes, thermal stress or thermal shock may occur due to a difference in thermal expansion coefficients between the thermoelectric elements and the electrodes, resulting in damages to the thermoelectric module and malfunction of the thermoelectric module.
Furthermore, an electric wire connected to the electrode of the thermoelectric module may be sealed through hermetic sealing, which may cause severe leakage current due to insulation resistance.
The strain of the electric wire may change the electrode resistance, which may degrade thermoelectric power generation performance.

Method used

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  • Method for packaging thermoelectric module
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  • Method for packaging thermoelectric module

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Embodiment Construction

[0051]Reference will now be made in detail to various embodiments of the present invention(s), examples of which are illustrated in the accompanying drawings and described below. While the invention(s) will be described in conjunction with exemplary embodiments, it will be understood that the present description is not intended to limit the invention(s) to those exemplary embodiments. On the contrary, the invention(s) is / are intended to cover not only the exemplary embodiments, but also various alternatives, modifications, equivalents and other embodiments, which may be included within the spirit and scope of the invention as defined by the appended claims.

[0052]According to various embodiments of the present invention, a method for packaging a thermoelectric module may be implemented by packaging at least one thermoelectric module 10 in a housing 41 and a cover 42 as illustrated in FIG. 6. At least one thermoelectric module 10 may be stably protected by the housing 41 and the cover...

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Abstract

A method for packaging a thermoelectric module may include thermoelectric module accommodation, of accommodating at least one thermoelectric module in a housing having a base and a sidewall, electric wire sealing, of sealing an electric wire of the thermoelectric module with a sealing tube, bonding member interposing, of placing a cover having a top portion and a sidewall on top of the housing and interposing a bonding member between the sidewall of the housing and the sidewall of the cover, and bonding, of bonding the sidewall of the housing and the sidewall of the cover that are hermetically sealed by the bonding member, in which the bonding member may be formed of a resin material.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]The present application claims priority to Korean Patent Application No. 10-2016-0087513, filed Jul. 11, 2016, the entire contents of which is incorporated herein for all purposes by this reference.BACKGROUND OF THE INVENTIONField of the Invention[0002]The present invention relates to a method for packaging at least one thermoelectric module and, more particularly, to a method for packaging a thermoelectric module, which can stably protect individual elements of the thermoelectric module such as thermoelectric elements, electrodes, and insulating boards, while maintaining the power generation performance of the thermoelectric module.Description of Related Art[0003]A thermoelectric module is used in a thermoelectric power generation system utilizing the Seebeck effect in which a difference in temperatures of both surfaces of the thermoelectric module is used to generate an electromotive force.[0004]During the thermoelectric power generation...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L35/34H01L35/32H01L35/04
CPCH01L35/34H01L35/04H01L35/32H10N10/17H10N10/01H10N10/82H10N10/80H10N10/13H10N10/81
Inventor KIM, BYUNG WOOKSONG, KYONG HWAKWAK, JIN WOOKIM, GYUNG BOKLYO, IN WOONGLEE, HAN SAEM
Owner HYUNDAI MOTOR CO LTD
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