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Slim heat-dissipation module

a heat dissipation module and heat dissipation module technology, applied in indirect heat exchangers, lighting and heating apparatus, etc., can solve the problems of thicker combined heat dissipation modules and higher costs, and achieve the reduction of manufacturing costs, improved heat dissipation efficiency of products, and reduced thickness

Inactive Publication Date: 2019-07-04
DELTA ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The invention is a heat dissipation module that uses both active and passive methods to improve efficiency and reduce thickness. The heat pipe and vapor chamber structures are integrated on a single plate, reducing manufacturing costs. The technical effect is improved heat dissipation with a thinner and more cost-effective design.

Problems solved by technology

However, the combined heat-dissipation module is thicker and costs more.

Method used

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  • Slim heat-dissipation module

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Effect test

second embodiment

[0033]FIGS. 5A and 5B show a slim heat-dissipation module D2 of the invention. In this embodiment, the second metal pillars arranged to define a first circulation groove 122 (located between the second metal pillars). The first circulation groove 122 corresponds to the second circulation groove 42. The supporting structure mentioned above can also be utilized in this embodiment.

third embodiment

[0034]FIGS. 6A and 6B show a slim heat-dissipation module D3 of the invention. In this embodiment, the vapor chamber unit 4′ has a third circulation structure 41′. A first circulation path P1′ is defined out of the third circulation structure 41′. A second circulation path P2′ is formed in the third circulation structure 41′. When the second fluid F2 is in the first state (a gaseous state), most of the second fluid F2 travels in the first circulation path P1′. When the second fluid F2 is in the second state (a liquid state), most of the second fluid F2 travels in the second circulation path P2′. In this embodiment, the third circulation structure 41′ is a porous structure. The third circulation structure 41′ has increased height and abuts the heat pipe area.

[0035]Utilizing the different embodiments above, the strength of the slim heat- dissipation module can be modified, and the flow rate of the second fluid in different states (a gaseous state and a liquid state) can be modified.

[0...

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Abstract

A slim heat-dissipation module is provided. The slim heat-dissipation module includes a first plate, a second plate, a first porous structure, a second porous structure, a first fluid, and a second fluid. The second plate is combined with the first plate to form a first type chamber and a second type chamber, wherein the first type chamber and the second type chamber are sealed and independent, respectively. The first porous structure is disposed in the first type chamber. The second porous structure is disposed in the second type chamber. The first fluid is disposed in the first type chamber. The second fluid is disposed in the second type chamber.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]This Application claims priority of China Patent Application No. 201711463208.7, filed on Dec. 28, 2017, the entirety of which is incorporated by reference herein.BACKGROUND OF THE INVENTIONField of the Invention[0002]The present invention relates to a slim heat-dissipation module, and in particular to a slim heat-dissipation module with a vapor chamber structure and a heat pipe structure.Description of the Related Art[0003]Conventionally, a slim vapor chamber performs a passive thermal equilibrium function, and the slim heat pipe performs an active thermal equilibrium function. When the product needs a passive thermal equilibrium function and an active thermal equilibrium function simultaneously, the slim vapor chamber must overlap the slim heat pipe to form the combined heat-dissipation module. However, the combined heat-dissipation module is thicker and costs more.BRIEF SUMMARY OF THE INVENTION[0004]In one embodiment, a slim heat-dissi...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F28D15/02F28D15/04
CPCF28D15/0233F28D15/0266F28D15/0275F28D15/046
Inventor HUANG, SHIH-LINWU, TING-YUAN
Owner DELTA ELECTRONICS INC