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96 results about "Increased height" patented technology

Method for detecting and controlling laser metal forming height on line

InactiveCN101893426AHeight uniform growthLaser formed surface smoothingUsing optical meansMetallic material coating processesMetal formingSpray nozzle
The invention discloses a method for detecting and controlling laser metal forming height on line. The method comprises the following steps of: vertically mounting a laser displacement sensor on a coaxial powder feeding nozzle; ensuring that laser emitted from the sensor is parallel to the laser emitted from a laser device; opening the laser device and performing cladding forming on the substrate by using a computer numerical control system; after a first layer is formed, controlling sensor offset by using the computer numerical control system; moving a detected surface below the sensor; ensuring that the laser emitted from the sensor is reflected by the detected surface and then received and output by a receiver of the sensor; averaging cladding height data by using the computer numerical control system; comparing an average with an ideal single-layer height; if the average is different from the ideal single-layer height, making the increased height of a cladding consistent with the ideal single-layer height by adjusting the power of the laser device; and continuing performing next cladding and height detection until a component is formed to a needed height by cladding, wherein the laser power is adjusted to gradually reduce along with the change of accumulation layers so as to ensure the uniform growth of the height of each layer.
Owner:XI AN JIAOTONG UNIV +1

Non-contact optical component surface profile measuring device and method thereof

The invention discloses a non-contact optical component surface profile measuring device and a method thereof. The device includes a host computer, an electronic control module, a probe supporting structure, an optical probe, a to-be-measured element, an element clamping device, a Z-axis electric translation stage, a dial indicator and an XY-axis electric translation stage; and the optical probe projects a focusing light spot on the surface of the to-be-measured element, and the light spot forms a three-hole bright spot through a three-hole diaphragm after being reflected back to an object lens. As the distance between the bright spots is related to the height position of the light spot, surface thicknesses can be obtained by collecting images in real time to calculate the distance betweenthe bright spots; in order to increase a height measuring range, the Z-axis electric translation stage can be used to move the to-be-measured element up and down, and the dial indicator can be used to measure the position of the element; and compared with traditional contact surface profile measuring systems, the device has the advantage of being non-contact, so that influences on the surface ofthe element can be avoided, and large measuring scope and high precision can be obtained.
Owner:NANJING UNIV OF INFORMATION SCI & TECH
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