Through electrode substrate and mounting substrate

Inactive Publication Date: 2019-08-22
DAI NIPPON PRINTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The object of this patent is to create a substrate with a through electrode that can prevent connection failures. This means that this substrate can prevent issues when trying to connect electronic components.

Problems solved by technology

When the electroconductive layer of the wiring layer is repeatedly subjected to stress, a defect may occur at a position where a plurality of electroconductive layers of wiring layers are connected to one another, resulting in connection failure between the electroconductive layers.

Method used

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  • Through electrode substrate and mounting substrate
  • Through electrode substrate and mounting substrate
  • Through electrode substrate and mounting substrate

Examples

Experimental program
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Effect test

first embodiment

[0141]A structure of a through electrode substrate according to the embodiment of the disclosure and a manufacturing method thereof are described in detail herebelow. The below embodiments are mere examples of this embodiments of the disclosure, and the disclosure should not be construed to be limited to these embodiments. In this specification, the terms “substrate”, “base member”, “sheet” and “film” are not differentiated from one another, based only on the difference in terms. For example, the “substrate” or the “base member” is a concept including a member that can be referred to as sheet or film. Further, terms specifying shapes, geometric conditions and their degrees, e.g., terms such as “parallel”, “orthogonal”, etc. and values of a length and an angle, etc., are not limited to their strict definitions, but should be construed to include a range capable of exerting a similar function. In addition, in the drawings referred in this embodiments, the same parts or parts having a ...

second embodiment

[0224]Next, a second embodiment is described with reference to FIGS. 36 to 40. The second embodiment differs from the aforementioned first embodiment only in that the through electrode 22 is a conformal via, and is substantially the same in other structure. In the second embodiment, the same part as that of the first embodiment is shown by the same reference number, and detailed description thereof is omitted. In addition, when the effect obtained in the first embodiment is apparently obtained also in the third embodiment, description thereof may be omitted.

[0225]FIG. 36 is a sectional view of a through electrode substrate 10 according to the second embodiment. FIG. 37 is an enlarged sectional view of the through electrode substrate 10 of FIG. 36. A through electrode 22 includes a sidewall portion 23, a first portion 24 and a second portion 25. The sidewall portion 23 extends along a sidewall 21 of the through hole 20. The first portion 24 is connected to the sidewall portion 23 fro...

third embodiment

[0238]Next, a third embodiment is described. The third embodiment differs from the aforementioned first embodiment only in that the inorganic layer 37 of the first wiring structure is positioned to face the second portion 38b of the electroconductive layer 38 not from the first side D1 but from the second side D2, and is substantially the same in other structure. In the third embodiment, the same part as that of the first embodiment is shown by the same reference number, and detailed description thereof is omitted. In addition, when the effect obtained in the first embodiment is apparently obtained also in the third embodiment, description thereof may be omitted.

[0239]FIG. 42 is a sectional view showing a through electrode substrate 10 according to the third embodiment. FIG. 43 is an enlarged sectional view of the through electrode substrate 10 of FIG. 42. The insulation layer 35 of the first wiring layer 31 of the first wiring structure 30 includes an organic layer 36 and an inorga...

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PUM

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Abstract

A through electrode substrate includes a substrate provided with a through hole, a through electrode positioned in the through hole, and a first wiring structure including at least a first wiring layer positioned on a first surface of the substrate, and a second wiring layer positioned on the first wiring layer. The first wiring layer and the second wiring layer respectively have an insulation layer and an electroconductive layer. A first insulation layer of the first wiring layer includes at least an organic layer. At least one wiring layer of the first wiring structure includes an inorganic layer having insulation properties, the inorganic layer being positioned to a first side of the organic layer of the first insulation layer of the first wiring layer.

Description

BACKGROUND OF THE INVENTIONField of the Invention[0001]The embodiment of the disclosure relates to a through electrode substrate. In addition, the embodiment of the disclosure relates to a mounting substrate comprising theBackground Art[0002]A member so-called through electrode substrate, which includes a substrate having a first surface and a second surface, a plurality of through holes provided in the substrate, and an electrode provided inside each through hole is widely used. For example, a through electrode substrate is used as an interposer interposed between two LSI chips, when a plurality of LSI chips are stacked in order to increase a packaging density of an LSI. In addition, a through electrode substrate is sometimes interposed between an element such as an LSI chip and a mounting substrate such as a motherboard. In the following description, an electrode provided inside a through hole is sometimes referred to as “through electrode”.[0003]The through electrode substrate in...

Claims

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Application Information

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IPC IPC(8): H01L23/498H01L21/48
CPCH01L23/49838H01L23/49827H01L21/486H01L21/481H01L23/49894H01L23/15H05K3/46H01L21/6835H01L2221/68345H01L2224/16225
InventorMAEKAWA, SHINJIKUDO, HIROSHITAKANO, TAKAMASAMAWATARI, HIROSHIASANO, MASAAKI
OwnerDAI NIPPON PRINTING CO LTD