Thermal barrier for downhole flasked electronics

a technology for electronics and thermal barriers, applied in the direction of insulation, survey, borehole/well accessories, etc., can solve the problems of inaccurate or even failure of thermally sensitive electronic components, undesirable heat especially for tools having electronic components, and inability to work accurately and accurately

Inactive Publication Date: 2019-10-17
BAKER HUGHES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patent describes some features of a technology, which may have benefits for certain applications. The technical effects of this technology are not fully explained in this text, but they can be inferred from what is known about its features. This information can help people understand the technology better and decide whether it can be useful for their purposes.

Problems solved by technology

Temperature and pressure conditions such as these can have an adverse effect on instruments used downhole.
Heat especially can be undesirable for tools having electronic components.
Elevated temperatures in the borehole (“downhole heat”) may cause thermally sensitive electronic components to work inaccurately or even fail.
Due to the nature of the operation, since the earth temperature gets hotter as true depth increases, the first option is not feasible.

Method used

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  • Thermal barrier for downhole flasked electronics
  • Thermal barrier for downhole flasked electronics
  • Thermal barrier for downhole flasked electronics

Examples

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Embodiment Construction

[0017]Aspects of the present disclosure relate to thermally isolating a thermally sensitive component in a tool downhole from a high-temperature environment. The present disclosure relates to devices and methods isolating heat sensitive components from a wellbore environment and / or heat generated by downhole components. In particular, aspects of the disclosure relate to flask-type thermal isolation systems. Aspects include apparatus for investigating a borehole or other use in a borehole intersecting an earth formation.

[0018]Aspects of the present disclosure provide a novel way of thermally isolating electronics inside downhole drilling or logging tools. Embodiments disclosed herein may include an assembly associated with a downhole tool and configured to thermally isolate a thermally sensitive component. The assembly may include a thermal housing; a chassis interior to the thermal housing; at least one thermally sensitive component mounted on the chassis; and a thermal isolation su...

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Abstract

Apparatus including an assembly associated with a downhole tool and configured to thermally isolate a thermally sensitive component. Components of the assembly include a thermal housing; a chassis interior to the thermal housing; at least one thermally sensitive component mounted on the chassis; and a thermal isolation support connecting the chassis to the tool. The thermal isolation support comprises an elongated thermal isolator having a first end and a second end opposite the first end, the thermal isolator connected to the tool at the first end and connected to the chassis at the second end, and a heat sink thermally coupled to the elongated thermal isolator at the second end. The second end of the elongated thermal isolator may comprise the only points of thermal coupling between the heat sink and the components other than the heat sink.

Description

FIELD OF THE DISCLOSURE[0001]In one aspect, this disclosure relates generally to thermally isolating heat sensitive components used in downhole applications in a borehole in an earth formation.BACKGROUND OF THE DISCLOSURE[0002]Drilling wells for various purposes is well-known. Such wells may be drilled for geothermal purposes, to produce hydrocarbons (e.g., oil and gas), to produce water, and so on. Well depth may range from a few thousand feet to 25,000 feet or more. Downhole tools, used during and after drilling, often incorporate various sensors, instruments and control devices in order to carry out any number of downhole operations. Thus, the tools may include sensors and / or electronics for formation evaluation, fluid analysis, monitoring and controlling the tool itself, and so on.[0003]Borehole temperatures can vary from ambient up to about 500° F. (260° C.) and pressures from atmospheric up to about 30,000 psi (206.8 mega pascals). Temperature and pressure conditions such as t...

Claims

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Application Information

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IPC IPC(8): E21B36/00E21B47/01
CPCE21B36/001E21B47/011E21B47/0175
InventorRAFIE, SAEEDBAILEY, RICHARD E.
OwnerBAKER HUGHES INC