Memory device supporting interleaved operations and memory system including the same
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[0020]Various embodiments of the present disclosure are described below with reference to the accompanying drawings. Elements and features of the disclosure, however, may be configured or arranged differently to form other embodiments, which may be variations of any of the disclosed embodiments.
[0021]In this disclosure, references to various features (e.g., elements, structures, modules, components, steps, operations, characteristics, etc.) included in “one embodiment,”“example embodiments,”“an embodiment,”“another embodiment,”“some embodiments,”“various embodiments,”“other embodiments,”“alternative embodiments,” and the like are intended to mean that any such features are included in one or more embodiments of the present disclosure, but may or may not necessarily be combined in the same embodiments.
[0022]In this disclosure, the terms “comprise,”“comprising,”“include,” and “including” are open-ended. As used in the appended claims, these terms specify the presence of the stated ele...
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