Edge inspection
a technology of inspection system and edge, applied in the direction of measurement device, material analysis, instruments, etc., can solve the problems of limited defect classification and yield issues in modern fabs
Active Publication Date: 2008-03-04
ONTO INNOVATION INC
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AI Technical Summary
Benefits of technology
The tool enables reliable detection and classification of defects along the wafer edge, improving process control and yield by capturing 100% of the wafer's circumference in under 10 seconds, with processed results available in under 30 seconds, achieving high accuracy and throughput.
Problems solved by technology
It has recently been discovered that wafer edge inspection is important for detecting delamination of thin films, chipping and cracking of the wafer, resist removal metrology, and particle detection, all of which cause yield issues in a modern fab.
This solution provides limited benefits in detecting particles and chip-outs, but is limited in classifying defects since the solution does not perform image processing.
Method used
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Embodiment Construction
[0022]FIG. 1 is a schematic diagram illustrating one embodiment of an edge inspection system 100. Edge inspection system 100 includes an edge top sensor 102, an edge normal sensor 104, a controller 118, a base 116, and a stage 110. Top edge sensor 102 includes a camera 111, and normal edge sensor 104 includes a camera 113. Stage 110 includes a motor 112, an encoder 114, and a support plate 108. Motor 112 is coupled to encoder 114 and support plate 108 to rotate support plate 108. Encoder 114 provides counts for controlling the position of motor 112. Support plate 108 supports a wafer 106 for inspecting an edge 107 of wafer 106. Controller 118 is electrically coupled to top edge sensor 102 through communication link 103, normal edge sensor 104 through communication link 105, and staging 110 through communication link 119. Controller 118 controls edge top sensor 102, edge normal sensor 104, and staging 110 for inspecting edge 107 of wafer 106.
[0023]FIG. 2 is a schematic diagram illust...
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Abstract
A semiconductor inspection tool comprises an edge top camera for obtaining images of a top edge of a wafer, an edge normal camera for obtaining images of a normal edge of the wafer, and a controller for receiving the images of the top edge of the wafer and the images of the normal edge of the wafer and for analyzing the images of the top edge of the wafer and the images of the normal edge of the wafer for wafer edge defects.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims the benefit of U.S. Provisional Application Ser. No. 60 / 486,953, filed Jul. 14, 2003.BACKGROUND[0002]1. Technical Field[0003]The present invention relates to an inspection system that inspects the edge of a semiconductor wafer or like substrate such as a microelectronics substrate.[0004]2. Background Information[0005]Over the past several decades, the semiconductor has exponentially grown in use and popularity. The semiconductor has in effect revolutionized society by introducing computers, electronic advances, and generally revolutionizing many previously difficult, expensive and / or time consuming mechanical processes into simplistic and quick electronic processes. This boom in semiconductors has been fueled by an insatiable desire by business and individuals for computers and electronics, and more particularly, faster, more advanced computers and electronics whether it be on an assembly line, on test equipment in...
Claims
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IPC IPC(8): G06K9/00G01N21/86
CPCG01N21/9503G01N2021/8825G01N2021/8841
Inventor WATKINS, CORYHARLESS, MARKABRAHAM, FRANCY
Owner ONTO INNOVATION INC