1614results about "Optical based geological detection" patented technology

There are many inventions described herein. Some aspects are directed to methods and/or apparatus to provide relative movement between optics, or portion(s) thereof, and sensors, or portion(s) thereof, in a digital camera. The relative movement may be in any of various directions. In some aspects, relative movement between an optics portion, or portion(s) thereof, and a sensor portion, or portion(s) thereof, are used in providing any of various features and/or in the various applications disclosed herein, including, for example, but not limited to, increasing resolution, optical and electronic zoom, image stabilization, channel alignment, channel-channel alignment, image alignment, lens alignment, masking, image discrimination, range finding, 3D imaging, auto focus, mechanical shutter, mechanical iris, multi and hyperspectral imaging, and/or combinations thereof. In some aspects, movement is provided by actuators, for example, but not limited to MEMS actuators, and by applying appropriate control signal thereto.

Apparatus and method for sensing the position, size, shape and location orientation of one or more objects in two dimensions. The position sensor uses arrays of light sensors mounted on a substrate. When an object passes in proximity to the light sensors light energy from a plurality of light sources is either reflected from the object to the light sensors, or is emitted directly to the light sensors. The light energy is then converted to individual signals and transmitted through circuit traces in a printed circuit board to a local controller. The information may then be processed to determine the size, position, shape and location orientation of an object.

An optical apparatus for transmitting light having a spectrum of wavelengths is disclosed. The apparatus comprises a plurality of optical devices design and constructed to decompose the light into a plurality of portions, respectively corresponding to different sub-spectra of the spectrum, such that each portion of the light is transmitted within a different optical device.

A method and system analyzes data acquired by image systems to more rapidly identify objects of interest in the data. In one embodiment, z-depth data are segmented such that neighboring image pixels having similar z-depths are given a common label. Blobs, or groups of pixels with a same label, may be defined to correspond to different objects. Blobs preferably are modeled as primitives to more rapidly identify objects in the acquired image. In some embodiments, a modified connected component analysis is carried out where image pixels are pre-grouped into regions of different depth values preferably using a depth value histogram. The histogram is divided into regions and image cluster centers are determined. A depth group value image containing blobs is obtained, with each pixel being assigned to one of the depth groups.

The X, Y and Rx positions of a mask stage are measured using two optical encoder-reading heads measuring displacements of respective grid gratings mounted on the mask stage. The grid gratings are preferably provided on cut-away portions of the mask table so as to be co-planar with the pattern on the mask itself. Measurements of the table position in the other degrees of freedom can be measured with capacitative or optical height sensors.

A process for obtaining an object image of at least one object (40) is described, wherein at least two partial images of the object (40) are taken under differing object conditions which are formed on the object with spatial patterns, wherein a non-linear dependence of the light detectable from the object point on the object conditions given at the object point exists and the partial images contain different contributions of various space frequency components of the object structure, and the desired object image is determined from the partial images by reconstruction of the space frequency components. Optical systems for implementing this type of process are also described.

A profile model for use in optical metrology of structures in a wafer is selected, the profile model having a set of geometric parameters associated with the dimensions of the structure. A set of optimization parameters is selected for the profile model using one or more input diffraction signals and one or more parameter selection criteria. The selected profile model and the set of optimization parameters are tested against one or more termination criteria. The process of selecting a profile model, selecting a set of optimization parameters, and testing the selected profile model and set of optimization parameters is performed until the one or more termination criteria are met.

A method and apparatus for reconstructing a surface shape of an object having contour lines, includes assigning points to each contour line. A first triangulation scheme is performed with respect to respective points on two adjacently-positioned contour lines, to determine a first surface shape for a portion of the object corresponding to the two contour lines. The first surface shape is checked to determine if the first surface shape is in error. If the first surface shape is not in error, the first surface shape is outputted for the portion of the object as determined by the first triangulation scheme, as a reconstructed surface shape for that portion of the object. If the first surface shape is in error, a second triangulation scheme is performed with respect to the respective points on the two contour lines, to determine a second surface shape for that portion of the object, and the second surface shape is outputted for that portion of the object as determined by the second triangulation scheme, as a reconstructed surface shape.

A drive unit drives a wafer table in a Y-axis direction based on a measurement value of an encoder that measures position information of the wafer table in the Y-axis direction and based on known correction information in accordance with position information of the wafer table in a non-measurement direction (e.g. Z, θz and θx directions) that is measured by an interferometer at the time of the measurement by the encoder. That is, the wafer table (a movable body) is driven in the Y-axis direction based on the measurement value of the encoder that has been corrected by correction information for correcting a measurement error of the encoder that is caused by a relative displacement of a head and a scale in the non-measurement direction. Accordingly, the movable body can be driven with high accuracy in a desired direction while measuring the position by the encoder, without being affected by the relative motion between the head and the scale in directions other than a direction to be measured (measurement direction).

The present invention provides methods and systems for aligning detection optics with a device by obtaining an optical profile of the system and comparing it with a preprogrammed layout of the various optical features of the device. The invention also provides methods of identifying devices by comparing the optical profile with a library of preprogrammed optical profiles of multiple devices.

Inspection guided overlay metrology may include performing a pattern search in order to identify a predetermined pattern on a semiconductor wafer, generating a care area for all instances of the predetermined pattern on the semiconductor wafer, identifying defects within generated care areas by performing an inspection scan of each of the generated care areas, wherein the inspection scan includes a low-threshold or a high sensitivity inspection scan, identifying overlay sites of the predetermined pattern of the semiconductor wafer having a measured overlay error larger than a selected overlay specification utilizing a defect inspection technique, comparing location data of the identified defects of a generated care area to location data of the identified overlay sites within the generated care area in order to identify one or more locations wherein the defects are proximate to the identified overlay sites, and generating a metrology sampling plan based on the identified locations.

A modular measurement device is provided for quickly and accurately performing non-contact measurements of various objects at different locations within a commercial or residential work area. The modular measurement device generally includes a laser base that is operable to project light onto a measured object; and a portable measurement module adapted to receive light reflected from a surface of the measured object and operable to determine dimensional measurement data for the measured object, where the portable measurement module is configured to releasably couple to the laser base. The operational components of the measurement device are partitioned between the portable measurement module and the laser base. In this way, a single portable measurement module having more expensive operational components may be used with different, less expensive laser bases, where each laser base may be adapted for a different application.

An organic photoelectric conversion element comprises: a pair of electrodes; an organic photoelectric conversion layer arranged between the pair of electrodes; and an positive hole blocking layer arranged between one of the pair of electrodes and the organic photoelectric conversion layer, wherein an ionization potential of the positive hole blocking layer is larger than a work function of the adjoining electrode by 1.3 eV or more, and wherein an electron affinity of the positive hole blocking layer is equal to or larger than that of the adjoining organic photoelectric conversion layer. An electron blocking layer may be arranged between the other one of the pair of electrodes and the organic photoelectric conversion layer, wherein its electron affinity is smaller than a work function of the adjoining electrode by 1.3 eV or more, and its ionization potential is equal to or smaller than that of the adjoining organic photoelectric conversion layer.

Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, critical dimension, a presence of defects, and a thin film characteristic. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.