Low profile electronic module with ejector mechanism

Abstract

An electronic module (100) includes a housing having a longitudinal body portion and a mounting portion extending rearward from the body portion, with a channel defined in a top or bottom section of the mounting portion; a slider member (61) accommodated in the channel of mounting portion; an actuator member (62) including a transversal beam (621) across the mounting portion and two leg portions (622) connected to opposite ends of the transversal beam and disposed outward of lateral sides of the mounting portion, said leg portions pivotally linked to the mounted portion of the housing and connected to the slider member; and a pull member (64) having two arm portions (641) spaced apart one another and an intermediate portion (642) connected to the arm portions, said two arm portions arranged under the transversal beam and engaged with the leg portions of the actuator member.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application is continuation-in-part (CIP) of U.S. patent application Ser. No. 12 / 287,966 filed on Oct. 14, 2008 and entitled “ELECTRONIC MODULE WITH EJECTOR MECHANISM”, which has the same applicant and assignee as the present invention. The disclosure of the related application is incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention generally relates to an electronic module, and more particularly to a low profile and easy manipulated electronic module.[0004]2. Description of Related Art[0005]SFP (Small Form-factor Pluggable), X-SFP and QSFP are all modules for fiber optic transmission or ordinary signal transmission. All of the modules are of small size or form factor which is important. The smaller the form factor of the module, the less space taken on a printed circuit board to which it couples. A smaller form factor allows a greater number of modules to be coupled on...

AI Technical Summary

Benefits of technology

The improved ejector mechanism provides a reliable and easy-to-use method for removing electronic modules from receptacles, reducing the risk of damage and improving user accessibility by leveraging the spring-back function for efficient module extraction.

Problems solved by technology

However, the smaller form factor makes it more difficult for a user to handle.

While, plugging in a new module is usually easy, it is more difficult to remove the failed module because of other components surrounding it.

It has been determined than this method is not very reliable with users complaining of the difficulty in removing pluggable modules in such manner.

Users often complain that traditional methods offer little leverage in getting a sufficient grip on the module when attempting to pull it out of a module receptacle.

Another complaint is that traditional actuators used to remove modules are inaccessible or invisible.

Other users complain than once released by the traditional method, it is difficult to withdraw the module out of its cage or module receptacle.

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