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Curable silicone resin composition, cured product thereof and photosemiconductor apparatus

a technology of silicone resin and cured products, applied in electrical devices, semiconductor devices, solid-state devices, etc., can solve the problems of modulus of elasticity, crack generation, and disconnection of bonding wires, and achieve high light extraction efficiency, high reliability, and high reliability

Active Publication Date: 2015-06-09
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0050]The curable silicone resin composition of the present invention is to provide a cured product having high light extraction efficiency, and high reliability at the reflow process. Accordingly, it is useful as a material for a photosemiconductor apparatus, a material for an optical apparatus or optical parts, an insulating material for an electronic apparatus or electronic parts, and a coating material, etc., having high reliability.

Problems solved by technology

However, modulus of elasticity of the epoxy resin is high, so that under stress by temperature cycles, a bonding wire may be disconnected or cracks may generate at the epoxy resin in some cases.
Also, because of the stress that the epoxy resin gives to the LED device, a crystal structure of a semiconductor material collapses and lowering in luminous efficiency is concern.
However, these methods use encapsulants containing an organic component with a larger amount, the cured composition causes cracking by the UV light having a short wavelength emitted from the photosemiconductor, and yellowing proceeds when it is used for a long period of term which leads lowering in brightness of the LED apparatus with a lapse of time.
On the other hand, such a silicone resin material generally has a tack (tackiness), and is a rubber material so that the material strength is weak.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

formulation example 1

Component (A)

[0125](Component (A-1)) 50 parts by mass of silicone oil having an average compositional formula: MVi2DF22.7,[0126](Component (A-2)) 50 parts by mass of a silicone resin having an average compositional formula: DVi2TF8,

(Component (B)) 5.4 parts by mass of hydrogen siloxane represented by an average compositional formula: MH3TF, and 5.4 parts by mass of hydrogen siloxane represented by the following formula (V),

[0127][0128](Component (C)) 0.25 parts by mass of a toluene solution containing chloroplatinic acid / 1,3-divinyltetramethyl-disiloxane complex which contains 1% by mass as a platinum atom content were stirred well to prepare Silicone composition 1.

formulation example 2

Component (A)

[0129](Component (A-1)) 90 parts by mass of silicone oil having an average compositional formula: MVi2DF134DF12,[0130](Component (A-2)) 10 parts by mass of a silicone resin having an average compositional formula: DVi2T9TF136,[0131](Component (B))[0132](Component (B) 12.3 parts by mass of hydrogen siloxane represented by an average compositional formula: MH3TF13,[0133](Component (C)) 0.1 parts by mass of a toluene solution containing chloroplatinic acid / 1,3-divinyltetramethyl-disiloxane complex which contains 0.5% by mass as a platinum atom content and 0.01 part by mass of ethynylcyclohexanol as a controller were stirred well to prepare Silicone composition 2.

example 1

[0134]With 100 parts by mass of the composition of Formulation Example 1 was uniformly mixed 5.0 parts by mass of silicone complex powder (available from Shin-Etsu Chemical Co., Ltd., product name: KMP-600, average particle diameter: 5 μm) to prepare Composition (a).

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PUM

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Abstract

The present invention is curable silicone resin composition which is an addition-curable silicone composition, and comprises:(A)(A-1) a compound having at least two aliphatic unsaturated groups per one molecule and represented by the following formula (1),(B) an organic silicon compound having at least two hydrogen atoms bonded to silicon atom per one molecule and having no aliphatic unsaturated group,(C) a hydrosilylation catalyst containing a platinum group metal, and(D) 0.1 to 500 parts by mass of silicone powder having an average particle diameter of 0.5 to 100 μm based on 100 parts by mass of the total Components (A) and (B).Thereby, there can be provided a curable silicone resin composition having high light extraction efficiency and useful as, for example, an encapsulant, a cured product thereof and a photosemiconductor apparatus.

Description

TECHNICAL FIELD[0001]The present invention relates to a curable silicone resin composition, a cured product thereof and a photosemiconductor apparatus.BACKGROUND ART[0002]As an encapsulating material of an LED device, an epoxy resin has generally been used. However, modulus of elasticity of the epoxy resin is high, so that under stress by temperature cycles, a bonding wire may be disconnected or cracks may generate at the epoxy resin in some cases. Also, because of the stress that the epoxy resin gives to the LED device, a crystal structure of a semiconductor material collapses and lowering in luminous efficiency is concern.[0003]As a measure thereof, a method of using a silicone-modified organic resin, a method of adding silicone fine particles to the epoxy resin, etc., have been proposed (see Patent Literature 1 and Patent Literature 2). However, these methods use encapsulants containing an organic component with a larger amount, the cured composition causes cracking by the UV lig...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): C08K5/5415H01L33/56C08G77/24C08L83/08C08G77/12C08G77/20
CPCH01L33/56C08G77/12C08G77/20C08G77/24C08L83/08H01L2224/48091H01L2224/73265H01L2224/45144
Inventor KOBAYASHI, YUKITOIWATA, MITSUHIROONAI, SATOSHI
Owner SHIN ETSU CHEM IND CO LTD