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Integrated circuit having oversized components and method of manufacture thereof

a technology of integrated circuits and components, applied in the field of components, can solve the problems of limiting the ability to design certain on-chip components, limiting the design ability of certain on-chip components, and limiting the quality factor of inductors to low values

Inactive Publication Date: 2015-05-05
BROADCOM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such foundry rules limit the ability to design certain on-chip components.
As such, by limiting the size of metal tracks, the quality factor of inductors is limited to low values.
Capacitance values of on-chip metal insulated metal capacitors are also limited due to the foundry rules.
Since the foundry rules limit the size of the plates, the capacitor values are limited, which, in turn, limit the uses of on-chip capacitors.

Method used

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Examples

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Embodiment Construction

[0015]FIGS. 1A and B illustrate top and side view of an integrated circuit 10 that includes an electrical element 12 created on a dielectric layer 14. The electrical element 12 may be used as at least one turn of an inductor, as one plate of a capacitor, as an electromagnetic shield, as a ground plane, as a power source trace, as a gate of a transistor, a source of a transistor, a drain of a transistor, or as an antenna.

[0016]The electrical element 12 includes a non-conducting region 16. As shown, the electrical element 12 has a dimension from end-to-end that is greater than integrated circuit (IC) manufacturing limits. The non-conducting region 16, which may be a single hole, is spaced at dimensions that are less than IC manufacturing limits. For instance, if the manufacturing limits for a CMOS process is 35 microns, the overall dimension of electrical element 12 exceeds the 35 microns. For instance, the width of the electrical element may be at least 50 microns when the electrical...

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PUM

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Abstract

An integrated circuit includes electrical components that include one or more electrical elements on one or more dielectric layers. The electrical element has a geometric shape that exceeds prescribed integrated circuit manufacturing limits in at least one dimension. To achieve compliance with foundry rules, the electrical element is fabricated to include a non-conducting region that negligibly effects the electrical characteristics. The non-conducting region includes a hole, a series of holes, a slot and / or a series of slots spaced within the electrical element at dimensions that are less than the integrated circuit manufacturing limits.

Description

TECHNICAL FIELD OF THE INVENTION[0001]This invention relates generally to integrated circuits and more particularly to components that comprise an integrated circuit.BACKGROUND OF THE INVENTION[0002]The general structure of an integrated circuit is known to include one or more dielectric layers on a substrate. As is further known, each of the dielectric layers supports a metal layer, which is etched or deposited to form integrated circuit components such as resistors, capacitors, inductors, transistors, conductive traces, et cetera. The number of dielectric layers, and hence the number of metal layers, along with acceptable physical dimensions of the dielectric layers and metal layers are dictated by the particular type of integrated circuit technology and the corresponding integrated circuit fabrication rules. For example, a CMOS integrated circuit may include multiple dielectric layers and multiple corresponding metal layers. Depending on the particular foundry rules, the size of ...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H01L23/522H01L21/76
CPCH01L21/76
Inventor CONTOPANAGOS, HARRYKOMNINAKIS, CHRISTOS
Owner BROADCOM CORP