Substrate treating apparatus

A substrate processing device and technology for substrates, which are applied in the directions of transportation and packaging, conveyor objects, electrical components, etc., can solve the problems of substrate impact and substrate cannot be transported, and achieve the effect of suppressing the occupied area.

Inactive Publication Date: 2007-09-19
DAINIPPON SCREEN MTG CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When transporting substrates into such a processing unit, even if the substrates are transported out without performing the processing of the processing unit itself, there is a problem that the chemical solution will affect the substrates that do not need to be processed originally.
[0006] In addition, even if one of the processing units on the transport path cannot transport the substrate, all the substrates will be in an untransportable state, and there is a problem that this effect will also occur on the substrate that does not need to be processed by the processing unit.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate treating apparatus
  • Substrate treating apparatus
  • Substrate treating apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

[0036] 1. The first implementation form

[0037] FIG. 1 is a view showing the structure of a substrate processing apparatus 1 of the present invention and a route for conveying a substrate. The substrate processing apparatus 1 has a verification code reader (Berry Code Reader) 10, transport robots 20-22, conveyor belts 30, 31, buffer storage (buffer) 40, 41, etching unit 50, separation unit 51, rotary unit 60 , inspection unit 70 and control unit 80 .

[0038] In FIG. 1 , the transfer robots 20 and 21 are shown as side views. The conveyor belt 30 and the etching unit 50 are shown side by side on the same plane, but actually the conveyor belt 30 is arranged above the etching unit 50 , and these form a two-layer structure. By arranging the conveyor belt 30 in this way, the substrate processing apparatus 1 can prevent an increase in the occupied area...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention provides a substrate treatment apparatus by which the influence of a treatment unit for carrying out prescribed treatment is reliably removed from a substrate which does not require the prescribed treatment. As the carrying paths of the substrate, the substrate treatment apparatus 1 is provided with a main carrying path MTR via an etching unit 50 and a peeling unit 51, a sub carrying path STR1 (conveyer 30) by-passing the etching unit 50, and a sub carrying path STR2 (buffer 41) by-passing the peeling unit 51. In addition, the substrate treatment apparatus 1 is provided with a carrying robot 20 or 22 for receiving and delivering the substrate between the main carrying path MTR and the sub carrying paths STR1 and STR2. For example, the substrate which is not to be etched is by-passed to carry the etching unit 50 by selecting the sub carrying path STR1 by a control unit 80 and carrying the substrate to the conveyer 30 by the carrying robot 20.

Description

technical field [0001] The present invention relates to a substrate processing apparatus that transports a substrate while excluding the influence of a processing unit provided therein on the substrate. Background technique [0002] In the prior art, a substrate processing apparatus has been proposed. In the substrate manufacturing process, processing units that perform a series of processes are provided along a substrate conveyance path, and the substrate is conveyed along the conveyance path while being processed by those processing units. For example, Patent Document 1 describes such a substrate processing apparatus. [0003] In the substrate processing apparatus described in Patent Document 1, there is only one transport path for substrates, and all substrates are transported by the same path. Therefore, even a substrate that is to be excluded from processing by a specific processing unit on the transport path (a substrate that is not subjected to the processing) must b...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/304H01L21/677H01L21/027H01L21/68
CPCG03F7/42H01L21/6704H01L21/67276H01L21/67745
Inventor 木村善和山本悟史
Owner DAINIPPON SCREEN MTG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap