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Programmable test socket

A technology for testing sockets and semiconductors. It is applied in the direction of measuring devices, measuring device casings, and single semiconductor device testing. It can solve the problems of increasing the cost of quality assurance testing procedures and time loss.

Inactive Publication Date: 2007-11-21
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These maintenance actions result in a loss of time as well as increased costs associated with quality assurance testing procedures

Method used

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  • Programmable test socket
  • Programmable test socket
  • Programmable test socket

Examples

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Embodiment Construction

[0023] Referring to FIG. 3 , where like numerals represent like components, there is shown component 100 , which includes a test socket 102 according to the present application. The test socket 102 may be coupled to a substrate 30, such as a printed circuit board. The test socket 102 includes a guide plate 104 and a housing 106. The housing 106 is preferably coupleable to the base plate 30, such as by screws or any other suitable fastening means (not shown here).

[0024] The housing 106 can be used to maintain the guide plate 104 in engagement with the electrical terminals of the substrate 30, and the housing 106 preferably can include a hole 108 in communication with the substrate 30 (when the test socket 102 is coupled to this hole), when the housing 106 is coupled to Base plate 30 may be used to provide slidable entry and exit for the guide plate. The guide plate 104 is preferably used to accommodate a semiconductor device 12 and maintain the fit between the electrical te...

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PUM

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Abstract

A test socket for a semiconductor device includes a guide plate operable to receive the semiconductor device and to maintain electrical terminals of the semiconductor device in registration with electrical terminals of a base, a shell operable to couple to the base and to maintain the guide plate in registration with the electrical terminals of the base, the shell including an aperture in communication with the base through which the guide plate can be inserted and removed when the shell is coupled to the base; and at least one fastener coupled to the shell and operable to maintain the semiconductor device in engagement with the guide plate and to urge the electrical terminals of the semiconductor device in contact with the electrical terminals of the base. A method for operating the test socket is also disclosed.

Description

technical field [0001] This case relates to a test socket applied to semiconductor devices, such as ball grid array semiconductor packages, chip-scale semiconductor packages, integrated circuit devices, etc., and more particularly, this case relates to a test socket comprising exchangeable guide plates A test socket which can be removed without actual maintenance. Background technique [0002] Please refer to FIG. 1 , which shows a side view of a conventional test socket 10 . The test socket 10 is used to accommodate a continuous semiconductor device 12 in order to perform various quality assurance tests, such as electrical tests. Semiconductor device 12 typically includes a plurality of electrical terminals 14 that are electrically connected to the device's operating circuitry. In end use, to access the functions of the operating circuitry, the electrical terminals 14 of the semiconductor device 12 are soldered to corresponding terminals (or pads) of the printed circuit b...

Claims

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Application Information

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IPC IPC(8): G01R1/04G01R31/26G01R1/073H01R33/76
CPCG01R1/0483H01L22/00
Inventor G·弗兰科维斯基
Owner INFINEON TECH AG