Check plate

An inspection board and inspection technology, which is applied in the field of inspection boards, can solve the problems of thermal paste 9 diffusion range damage, difficulty in correctly judging thermal paste 9 damage, etc.

Inactive Publication Date: 2008-01-09
BOARDTEK COMP SUZHOU
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this method is not only troublesome, but also the diffusion range of thermal paste 9 is easy to be destroyed because of the action of separating the chip 70 circuit board and heat sink 8, so that the observed diffusion situation is not the actual diffusion situation, so that It is difficult to correctly judge whether the thermal paste 9 applied at the beginning is the right amount
Furthermore, this method of separating the circuit board of the chip 70 and the heat sink 8 is easy to damage parts on the circuit board of the chip 70 or the heat sink 8 during the separation operation, such as the plug 80 , which will additionally increase the cost of

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Check plate
  • Check plate
  • Check plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] In the following description, the circuit board 7 and the heat sink 8 disclosed in FIGS. 7 and 8 will be used to illustrate how the present invention combines the heat sink 8 by simulating the circuit board 7 . However, this is only for convenience of description. In fact, the present invention can also simulate other devices, and the combined device is not limited to the heat sink 8, and the thermal conductive paste 9 can also be a paste medium with other specific functions, such as conductive glue.

[0024] The present invention is used to simulate the appearance size (such as surface profile, area and thickness, etc.) of at least a part of a first device, and the simulated part of the present invention is see-through, so it is possible to apply different heat dissipation pastes several times Get an optimal coating amount after the amount. In this way, the optimal coating amount can be applied to the actual combination production process of the first device and a sec...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention relates to an inspecting board for simulating bound condition of a first device and a second device, and utilizing said bound condition to judge that the pasty medium coated quantity and distribution range on interface between said first device and second device after which are bound are proper or not. Said inspecting board includes a simulation portion and sighting surface whose back is opposite to said simulation portion. After the inspecting board is combined with said second device, the simulation portion can be sighted by means of sighting surface, so that the diffusion condition of the pasty medium can be sighted so as to further obtain a standard coating quantity.

Description

technical field [0001] The present invention relates to a test tool with simulation capability, especially a test board, which can simulate a first device combined with a second device, so as to deduce the standard coating amount of a paste medium for the first device. , The two devices are used when they are actually combined. Background technique [0002] In the assembly of mechanisms, it is often necessary to combine one device with another, and for a specific purpose, the simulation part between the two devices is also coated with a paste medium with specific functions. Take the chip 70 on the circuit board 7 shown in FIG. 8 as an example. The chip 70 is a SIS651 chipset with a substrate 71 at the bottom and a metal circular heat sink 72 at the top, and the package type is BGA. Because this chip 70 can produce high heat during operation, therefore, must combine a radiator 8 on this chip 70 for heat dissipation, and in order to increase the thermal conductivity of interf...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G01N21/01
Inventor 罗万琳
Owner BOARDTEK COMP SUZHOU
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap