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An inspection board and inspection technology, which is applied in the field of inspection boards, can solve the problems of thermal paste 9 diffusion range damage, difficulty in correctly judging thermal paste 9 damage, etc.
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[0023] In the following description, the circuit board 7 and the heat sink 8 disclosed in FIGS. 7 and 8 will be used to illustrate how the present invention combines the heat sink 8 by simulating the circuit board 7 . However, this is only for convenience of description. In fact, the present invention can also simulate other devices, and the combined device is not limited to the heat sink 8, and the thermal conductive paste 9 can also be a paste medium with other specific functions, such as conductive glue.
[0024] The present invention is used to simulate the appearance size (such as surface profile, area and thickness, etc.) of at least a part of a first device, and the simulated part of the present invention is see-through, so it is possible to apply different heat dissipation pastes several times Get an optimal coating amount after the amount. In this way, the optimal coating amount can be applied to the actual combination production process of the first device and a sec...
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