Check plate

Abstract

The present invention relates to an inspecting board for simulating bound condition of a first device and a second device, and utilizing said bound condition to judge that the pasty medium coated quantity and distribution range on interface between said first device and second device after which are bound are proper or not. Said inspecting board includes a simulation portion and sighting surface whose back is opposite to said simulation portion. After the inspecting board is combined with said second device, the simulation portion can be sighted by means of sighting surface, so that the diffusion condition of the pasty medium can be sighted so as to further obtain a standard coating quantity.

Description

technical field [0001] The present invention relates to a test tool with simulation capability, especially a test board, which can simulate a first device combined with a second device, so as to deduce the standard coating amount of a paste medium for the first device. , The two devices are used when they are actually combined. Background technique [0002] In the assembly of mechanisms, it is often necessary to combine one device with another, and for a specific purpose, the simulation part between the two devices is also coated with a paste medium with specific functions. Take the chip 70 on the circuit board 7 shown in FIG. 8 as an example. The chip 70 is a SIS651 chipset with a substrate 71 at the bottom and a metal circular heat sink 72 at the top, and the package type is BGA. Because this chip 70 can produce high heat during operation, therefore, must combine a radiator 8 on this chip 70 for heat dissipation, and in order to increase the thermal conductivity of interf...

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Problems solved by technology

But this method is not only troublesome, but also the diffusion range of thermal paste 9 is easy to be destroyed because of the action of separating the chip 70 circuit board and heat sink 8, so that the observed diffusion situation is not the actual diffusion situation, so that It is difficult to correctly judge whether the thermal paste 9 applied at the beginning is the right amount

Furthermore, this method of separating the circuit board of the chip 70 and the heat sink 8 is easy to damage parts on the circuit board of the chip 70 or the heat sink 8 during the separation operation, such as the plug 80 , which will additionally increase the cost of

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