Unlock instant, AI-driven research and patent intelligence for your innovation.

Statistical process analyse system and statistical process analyse method performed by computer

A computer and statistical parameter technology, applied in the general control system, control/regulation system, test/monitoring control system, etc., can solve the problems of heavy workload, difficulty in system resource reservation, failure to achieve machine parameter control, etc., to achieve The effect of fast and effective control of the process

Active Publication Date: 2008-07-02
TAIWAN SEMICON MFG CO LTD
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, the additional functions of the manufacturing execution system are becoming more and more complex, making its workload more and more heavy
Therefore, it is also difficult to reserve too many system resources for the calculation and processing of the process parameters of the machine
Therefore, the current manufacturing execution system can only handle a small number of machine parameters, so it is impossible to achieve effective and real-time machine parameter control

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Statistical process analyse system and statistical process analyse method performed by computer
  • Statistical process analyse system and statistical process analyse method performed by computer
  • Statistical process analyse system and statistical process analyse method performed by computer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] In order to make the purpose, features and advantages of the present invention more obvious and understandable, the preferred embodiments are specially cited below, together with the attached drawings Figure 1 to Figure 5 , give a detailed explanation. The description of the present invention provides different examples to illustrate the technical features of different implementations of the present invention. Wherein, the configuration of each element in the embodiment is for illustration, not for limiting the present invention. In addition, part of the symbols in the figures in the embodiments are repeated for the purpose of simplifying the description, and do not imply the relationship between different embodiments.

[0025] figure 1 A schematic diagram showing a manufacturing system with statistical process analysis according to an embodiment of the present invention. The manufacturing system 10 executes the wafer manufacturing process, which includes a processi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A system for performing statistical process control. A storage device stores a plurality of SPC charts, specifying data collected from a system during testing. A controller categorizes the SPC charts into a plurality of groups based on characteristics thereof. A detector determines whether the charts in any of the groups violate a preset rule. An alarm generator generates alarm information identifying the chart violating the rule.

Description

technical field [0001] The present invention relates to process control, and more particularly to systems and methods for collecting data and performing statistical process analysis in a manufacturing environment. Background technique [0002] With the development of semiconductor manufacturing related technologies, the complexity of semiconductor product manufacturing is increasing day by day. At present, in the manufacture of semiconductor products, due to factors such as size or arrangement, the tolerance for errors is very small. However, in complex processes, errors often occur due to poor process parameters. Since there is no previous process data for reference when the semiconductor product is first produced, it is impossible to properly set the process or tool-related process parameters. Therefore, the aforementioned errors are particularly prone to occur when the semiconductor product is first produced. [0003] In a semiconductor manufacturing enterprise, fabrica...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/00G06F17/40G06F19/00G06Q50/00G05B19/418G05B23/00H01L21/00H01L21/02
CPCG05B23/0235G05B23/02G05B23/027Y10T70/5124Y10T70/5115
Inventor 黄明彰陈明发
Owner TAIWAN SEMICON MFG CO LTD