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Assembly of FPC and PCB

A component and gold finger technology, applied in electrical components, printed circuit components, structural connections of printed circuits, etc., can solve problems such as low welding efficiency, affecting product welding quality, and difficult to effectively bridge FPC and PCB.

Active Publication Date: 2008-08-13
菏泽阳欣光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The number of FPC (flexible circuit board) gold fingers has increased significantly, and the width and gap of gold fingers have been reduced correspondingly in a limited space, so FPC gold fingers are prone to internal tin connection, and FPC and PCB (printed circuit boards) are also difficult. Effective bridging, resulting in a large increase in welding defects, low welding efficiency, which seriously affects the welding quality of the product

Method used

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  • Assembly of FPC and PCB

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Embodiment Construction

[0009] A FPC and PCB assembly, such as figure 1 As shown, it includes an FPC substrate 1, a gold finger 2 disposed on the end side of the FPC substrate, a PCB 3 and a gold finger 4 located on the end side of the PCB, the gold finger 2 on the FPC substrate extends from the outside to the inside of the FPC substrate 1, and on the FPC substrate The front end of gold finger 2 is set back relative to the front end of gold finger 4 on the PCB and is connected by soldering.

[0010] The golden fingers on the FPC substrate are formed by scraping off the insulating glue on the end side of the FPC substrate.

[0011] In the existing structure where the front end of the gold finger on the FPC substrate is aligned with the front end of the gold finger on the PCB, excess solder may flow inward along the gold finger on the PCB during soldering. Since the gap between the FPC substrate and the PCB is small, redundant The tin will form tin beads and be flattened. After the flattened tin is co...

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PUM

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Abstract

Present invention discloses FPC and PCB assembly, which contains FPC base plate, golden finger located on FPC base plate end, PCB and golden finger located at PCB end, the golden finger of FPC extended form outside to inside, the front end of FPC and PCB are soldering lead welded. duo to the strong adsorption force of metal to soldering lead, the otiose soldering lead flowing outward along the front end part of golden finger of PCB to exceed that of FPC base plate to realize the effect bridging and reliable connection.

Description

technical field [0001] The invention relates to an assembly of FPC and PCB. Background technique [0002] The number of FPC (flexible circuit board) gold fingers has increased significantly, and the width and gap of gold fingers have been reduced correspondingly in a limited space, so FPC gold fingers are very prone to internal tin connection, and FPC and PCB (printed circuit boards) are also difficult. Effective bridging causes a large increase in welding defects and low welding efficiency, which seriously affects the welding quality of the product. Contents of the invention [0003] The object of the present invention is to provide an assembly of FPC and PCB in order to solve the above problems. [0004] In order to achieve the above object, the present invention proposes an assembly of FPC and PCB, including an FPC substrate, a gold finger located at the end side of the FPC substrate, a PCB and a gold finger positioned at the end side of the PCB, and the gold finger on...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/14H01R12/00
Inventor 邹群
Owner 菏泽阳欣光电科技有限公司
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