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Method for improving coverage rate of electron elements test

A technology of electronic parts and coverage rate, applied in the field of improving the test coverage rate of electronic parts, can solve the problems of unable to provide more information, unable to improve the coverage rate, lack of test points, etc., to improve the test coverage rate, improve the writing quality, easy effect of remedial

Inactive Publication Date: 2008-09-03
丁影 +1
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  • Description
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Problems solved by technology

[0005] In view of the problems of the above-mentioned known technologies, the present invention provides a method for improving the coverage rate of electronic parts testing, to solve the shortcoming that the known electronic parts testing methods cannot improve the coverage rate, and also overcome the lack of test points provided by the known electronic parts testing methods. Disadvantages of not being able to provide more information

Method used

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  • Method for improving coverage rate of electron elements test
  • Method for improving coverage rate of electron elements test

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Embodiment Construction

[0028] First, see figure 2 , the present invention is a method S1 for improving the test coverage of electronic parts, including performing circuit design operations (step S10), providing electronic part data for circuit design (step S20), taking out an electronic part test data (step S30), providing A circuit board and production-test position table (step S40), provide an electronic component test tool and a test program (step S50), judge whether the test program is applicable (step S60), perform debugging (step S70) and obtain a Test report (step S80).

[0029] Please refer to Figure 1 and figure 2 As shown, the present invention is a method S1 for improving the test coverage of electronic parts, first performing circuit design (step S10), then providing electronic part data for circuit design (step S20), providing electronic parts required for circuit design The relevant data, and then, take out an electronic component test data (step S30), this electronic component test ...

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Abstract

The invention discloses a method of increasing electric parts test covering ratio that comprises circuit design work, providing electric parts data of circuit design, picking up electric parts test data, providing a circuit board and producing a test position list, providing a electric parts test tool and a test program, judging whether the test program is applicable, correcting work and getting a test report to improve the electric parts test covering ratio, at the same time, current test method that only provides fewer test point and can not provide more information can be improved.

Description

technical field [0001] The invention relates to a method for improving the test coverage rate of electronic components, in particular to a method capable of providing test point placement information to improve the IC test coverage rate. Background technique [0002] At present, manufacturers who design circuit boards mostly complete the work of placing test points before drawing, and then hand over the drawing to the subsequent process to continue the work after drawing. In the design for manufacturability (DFM) in the factory, the test pads (ICT Test PAD list) of the internal circuit test equipment and the test coverage report (Testability report) of the circuit test feedback are used as the basis to route the test points. There is no main placement priority in the placement of points, but the circuit board area, wiring factors, and layout are considered as a whole, and the test pads (Test pads) that can be accommodated are placed as much as possible. [0003] According t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50G06Q10/00
Inventor 王宏圣何其烨马定国游棋辉曹惠国
Owner 丁影