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Method and arrangement for temperature calibration

A temperature point and temperature calibration technology, applied in thermometer testing/calibration, thermometers, measuring devices, etc., can solve problems such as longer than the total test time, a large amount of time, etc.

Inactive Publication Date: 2008-11-26
NXP BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It takes a lot of time to bring the chip to two different temperatures, which is longer than the total test time

Method used

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  • Method and arrangement for temperature calibration
  • Method and arrangement for temperature calibration
  • Method and arrangement for temperature calibration

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] figure 1 A block diagram of an on-chip temperature sensor according to the present invention is shown. The signal generating unit 2 generates a first signal proportional to temperature. This first signal is provided to the temperature extraction unit 3 for calculating the first temperature point. Furthermore, the signal generating unit 2 generates a signal offset during the calibration process, which is combined with the first signal to define the second signal. By providing the temperature extraction unit 3 with the second signal, the temperature extraction unit 3 can be misled. The temperature extraction unit 3 calculates the second temperature point without heating the chip to the second temperature.

[0028] The signal supplied to the temperature extraction unit 3 is converted, eg in an AD converter 4 , and by using the implemented scheme, the temperature extraction unit 3 digitally calculates the actual temperature from the supplied signal. These schemes are pr...

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PUM

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Abstract

The invention concerns an arrangement on a semiconductor chip for calibrating temperature setting curve having a signal generation unit (2) for providing a first signal (Iptat1,Vptat1, fptat1), which is proportional to the actual uncalibrated temperature T1 of the chip. To avoid bringing the chip on a second temperature it is proposed to read a first signal (Iptat1,Vptat1, fptat1), which is proportional to the actual uncalibrated temperature Tl of the chip and generate a signal offset (Ivirt, Vvirt, fvirt), which is combined with the first signal (Iptat1,Vptat1, fptat1) defining a second signal (Iptat2, Vptat2, fptat2) and to extract a first actual temperature T1 from the first signal (Iptat1,Vptat1, fptat1) and a second uncalibrated temperature T2 from the second signal (Iptat2, Vptat2, fptat2).

Description

technical field [0001] The invention relates to a method for calibrating a temperature profile on a semiconductor chip, and moreover to a device for calibrating a temperature profile. Background technique [0002] In order to adjust the proper parameters of the chip, a reliable temperature value is required. This temperature value is extracted from the characteristic signal and the temperature setting curve for the semiconductor chip. [0003] It is very important to have the exact temperature of the chip because a large number of parameters for operating the chip relate to the actual temperature, so if the temperature is fluctuating, adapt the parameters to the actual temperature value. For example, in order to drive a display device, a certain voltage is necessary. The value of the supplied voltage depends on the chip temperature, which is different in some cases and ambient conditions. The actual temperature of the chip was therefore measured in order to accommodate th...

Claims

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Application Information

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IPC IPC(8): G01K15/00
CPCG01K15/002
Inventor S·罗米尔P·奥伊哈芬
Owner NXP BV