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Device for cleaning grinding head

A technology of cleaning device and grinding head, which is applied in the direction of grinding/polishing safety device, grinding/polishing equipment, surface polishing machine tool, etc., which can solve the problem of reduced cleaning efficiency and effect, long cleaning time, and inability to ensure cleanness and other problems, to achieve flexible and convenient installation, enhance local cleaning capabilities, and achieve the effect of focused cleaning

Inactive Publication Date: 2009-01-07
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Yet, because the cleaning strength of existing cleaning device is not enough, for some rough areas that are difficult to clean in the grinding head, as being positioned at the wafer edge pressing ring (retaining ring) 103 and buffer film (membrane) 104 on the lower surface of the grinding head support plate 106 The abrasive liquid and residues in the gap 108 between the holes are difficult to remove under normal cleaning conditions. It often takes a long time to clean, and it still cannot be cleaned cleanly, resulting in a decrease in the overall cleaning efficiency and effect, which will affect the next time. grinding

Method used

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  • Device for cleaning grinding head
  • Device for cleaning grinding head
  • Device for cleaning grinding head

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no. 1 Embodiment

[0026] For the grinding of the same wafer, the grinding process can be divided into three stages: coarse grinding, fine grinding and fine grinding, and each stage has different requirements for polishing pad and slurry. stage, because of its lower grinding rate and higher flatness requirements, the used grinding pad will be denser and the particles of the grinding liquid will be finer. That is, in different grinding phases, different grinding pads and grinding fluids need to be used, so in the grinding process of wafers, the grinding head (head) holding the wafers needs to be moved between the grinding pads used in different grinding phases , for different stages of grinding, and at the same time, it is necessary to replace different grinding fluids at each stage. figure 2 It is a schematic diagram of grinding equipment adopting the cleaning device of the present invention, as figure 2 As shown, the equipment has four grinding heads 201a to 201d in total, three different gr...

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Abstract

The present invention discloses a cleaning device of grinding head; the grinding head has a central area and a marginal area; the marginal area has seams; the cleaning device comprises a cleaning pipe connected with the main pipeline and a plurality of cleaning nozzles derived from the cleaning pipe; the nozzles are equipped at a position corresponding to the central and marginal areas of the grinding head; the height of nozzles whose position is corresponding to the central area is lower than that of the nozzles whose position is corresponding to the marginal area. The present invention of a cleaning device adjusts the distance between the cleaning nozzles and the cleaned parts according to cleaning requirements; with the same cleaning conditions, the local cleaning capability is enhanced and key cleaning of cleaned parts, which is very difficult for implementation, is realized; at the same time, the cleaning efficiency is promoted.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a cleaning device for a grinding head. Background technique [0002] With the rapid development of ULSI (Ultra Large Scale Integration), the manufacturing process of integrated circuits has become more and more complex and sophisticated. In order to improve integration and reduce manufacturing costs, the feature size of components (Feature Size) continues to decrease, and the number of components per unit area of ​​the chip continues to increase. It is difficult for planar wiring to meet the requirements of high-density distribution of components, and only multi-layer wiring technology can be used. , using the vertical space of the chip to further increase the integration density of the device. However, the application of multi-layer wiring technology will cause the surface of the silicon wafer to be uneven, which is extremely unfavorable for graphics product...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/304B24B29/02B24B55/00
Inventor 刘国平房现飞高志强李宁
Owner SEMICON MFG INT (SHANGHAI) CORP
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