Unlock instant, AI-driven research and patent intelligence for your innovation.

Leadframe-based component housing, leadframe strip, surface-mounted electronic component, and production method

A technology of electronic components and lead frames, which is applied in the field of component housings, can solve the problem of destroying the sealing of components and the working principle of components, and achieve the effect of small total height

Inactive Publication Date: 2009-01-07
OSRAM OPTO SEMICON GMBH & CO OHG
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The possibility of achieving this by simply reducing the thickness of the housing base on the back of the lead frame is also very limited, because, as mentioned above, in the case of realizing the rear of the housing the layer thickness of the injection molding material is too thin to be manufactured by injection molding. When housing, the injection molding material is easily pulled away with the nozzle to be removed, thereby destroying the sealing of the component and the working principle of the component

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Leadframe-based component housing, leadframe strip, surface-mounted electronic component, and production method
  • Leadframe-based component housing, leadframe strip, surface-mounted electronic component, and production method
  • Leadframe-based component housing, leadframe strip, surface-mounted electronic component, and production method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0056] FIG. 1 shows a perspective view of a surface-mounted component with a housing according to the prior art.

[0057] The housing base body 100 of rectangular outline shown in FIG. 1 has a front part 8a and a rear wall 8b, and a reflector recess with a radiation exit window 12 is arranged in the front part 8a. The first connection bar 2 a and the second connection bar 2 b are partially embedded in the housing base body and are connected to a radiation-emitting chip (not shown here) (hidden inside the housing base body). The protruding parts (external contacts) of the connection strip are used to connect the component to, for example, an external printed circuit board. The above-mentioned external contacts may extend perpendicularly to the respective side walls of the housing, or be bent around the base of the housing as shown in phantom in FIG. 1 .

[0058] The lead frame strip 1 of the embodiment shown in Figures 2a and 2b, for example, is pre-produced by stamping and ha...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a leadframe-based housing for a surface-mounted component, in particular a radiation-emitting component, which has electrical connection bars and at least one chip-mounting area, and which is in one of the connection bars According to the invention, an injection window is provided which enables the production of leadframe-based housings with a low thickness by injection molding. In addition, a method of making such an enclosure is given.

Description

technical field [0001] The invention relates to a leadframe-based component housing, a leadframe strip with a pre-molded component housing and a surface-mountable electronic component, in particular a radiation-emitting or radiation-detecting chip. A component, such as a light emitting diode, and a method of manufacturing the lead frame-based component housing. Background technique [0002] In particular, the invention relates to light-emitting diode components suitable for surface mounting on printed circuit boards, in which an optimal Preferably, the recess is formed as a reflector with a radiation window oriented towards the end face of the element housing. An electromagnetic radiation-emitting chip is located in the recess, while the recess itself is filled, for example, with a sealing material through which the electromagnetic radiation emitted by the chip is permeable. [0003] Component enclosures of this type are also suitable for radiation-detecting chips—in this ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L31/0203H01L31/02H01L33/48H01L33/62
CPCH01L33/486H01L2924/0102H01L31/0203H01L2924/01078H01L2924/01004H01L2224/48091H01L33/62H01L2924/12041H01L2224/48247H01L2924/00014
Inventor J·E·索尔格
Owner OSRAM OPTO SEMICON GMBH & CO OHG