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Lead-free alloy tin-plating copper wire and fabricating method thereof

A technology of lead-free alloy and tin-plated copper wire, which is applied in the field of basic materials in the electronic industry, can solve the problems that the coating on the surface of copper wire is prone to eccentricity and cannot meet the technical requirements of electronic products, and achieves improved product quality, high strength, and improved utilization. rate effect

Inactive Publication Date: 2009-04-22
天津市宏远电子有限公司
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Problems solved by technology

[0007] 1. The coating on the surface of the copper wire is prone to eccentricity due to the influence of gravity in the molten state, which cannot meet the process requirements of electronic products

Method used

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  • Lead-free alloy tin-plating copper wire and fabricating method thereof
  • Lead-free alloy tin-plating copper wire and fabricating method thereof

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Embodiment Construction

[0025] In order to further understand the characteristics and effects of the present invention, in conjunction with the attached figure 2 The detailed implementation is as follows:

[0026] First, according to the manufacturing method of lead-free alloy solder, four metal materials, 98.5% tin, 0.5% copper, 0.8% bismuth, and 0.2% indium, are weighed by weight; first put tin and copper into a constant temperature furnace at 650°C according to the above weight Smelting in the tin to make the copper completely melted in the tin, and then out of the mold into a tin-copper alloy ingot; put the above remaining tin into the smelting furnace and raise the temperature to 280°C, then put in the above ratio of indium and bismuth to stir until completely melted, and then heat up to 360°C, put the above tin-copper alloy ingot, stir to melt it completely, then raise the temperature to 410°C, stir for 10 minutes to achieve uniform mixing, and then mold it into a lead-free alloy solder ingot....

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Abstract

A lead-free alloy-Sn coated copper wire is prepared through proportionally mixing Sn as basic material with In, Bi and Cu, smelting to obtain lead-free alloy solder, and hot dipping of bare copper wire. Its advantages are high strength, weldability, and resistance to high temp and oxidizing, and low cost.

Description

a technical field [0001] The invention belongs to the field of basic materials in the electronic industry, in particular to a lead-free alloy tinned copper wire and a manufacturing method thereof. Two background technology [0002] Tinned copper wire is a basic material in the electronics industry, suitable for the production of lead wires for electronic components and jumper wires for circuit boards in complete machines. There are two traditional processes for the production of tinned copper wires, one is the electroplating process, the other is the hot-dipping process, using solder lead-tin alloy or pure tin. Because the performance of pure tin coating is very poor, it is generally rarely used. The advantage of the electroplating process is that the coating is uniform and the concentricity is good, but it consumes a lot of energy, causes serious environmental pollution, the cost of waste liquid treatment is high, and there are many environmental problems to be solved, so i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C2/08
Inventor 邱铁龙李忠印
Owner 天津市宏远电子有限公司
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