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Mold, pattern forming method, and pattern forming apparatus

A mold and pattern technology, applied in the field of mold and substrate alignment, can solve the problems of poor visibility of alignment marks and inability to clearly observe alignment marks, etc.

Inactive Publication Date: 2009-06-24
CANON KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] More specifically, since the resin is brought into contact with the alignment marks on the mold side, sometimes the alignment marks cannot be clearly observed
Also, when the difference in refractive index between the mold and the resin is insufficient, the visibility of the alignment mark is extremely poor

Method used

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  • Mold, pattern forming method, and pattern forming apparatus
  • Mold, pattern forming method, and pattern forming apparatus
  • Mold, pattern forming method, and pattern forming apparatus

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0090] (first embodiment: mold 1)

[0091] will refer to figure 1 The mold of this embodiment is described.

[0092] refer to figure 1 , the mold 1100 has a first surface 1050, a second surface 1060 opposite to the first surface 1050, a pattern area 1000 formed on the first surface 1050, embedded in the mold 1100 so as not to be exposed on the first surface 1050 and the second surface Marks for alignment (alignment marks) 1070 on 1060 .

[0093]The material used to form the mold 1100 and the material used to form the alignment mark 1070 are different from each other, so that the refractive index may be different therebetween. In consideration of optically reading the alignment mark 1070, the difference in refractive index is preferably not less than 0.1, for example. The material of the alignment mark 1070 is not particularly limited as long as it can secure a difference in refractive index from the mold 1100 and can be optically read. For example, alignment marks 1070 ma...

no. 2 example

[0147] (second embodiment: mold 2)

[0148] The mold of this embodiment is characterized in that it includes a first surface having a pattern area for transfer, a second surface opposite to the first substrate, a first mark provided on the first substrate, and a marker provided toward the second substrate. The second mark on the position of the second surface away from the first surface. The second marker is for example in Figure 3A and 3B Mark 102 shown in .

[0149] refer to Figures 3A to 3D Describe the model more explicitly.

[0150] In these figures, with Figures 2A to 2D The same reference numerals denote the same parts or parts as those described in the first embodiment.

[0151] for Figures 3A to 3D , the first mark 1077 is disposed on the same surface as the pattern area 101 having the embossed portion (not shown). The first surface is a surface on which the pattern region 101 is formed, and the second surface is a surface 3101 opposite to the first surfac...

no. 3 example

[0157] (Third embodiment: pattern forming method 1)

[0158] The pattern forming method of this embodiment is performed as follows.

[0159] First, a mold is prepared which is provided with a first surface including a pattern area, a second surface opposite to the first surface, and an alignment mark provided at a position away from the first surface toward the second surface. For example, the model is shown in figure 1 to 3.

[0160] Then, the patterned area of ​​the mold and the coating material of the substrate, such as photocurable resin or resist, are brought into contact with each other.

[0161] exist Figure 17A Among them, 5000 represents the substrate, 3000 represents the coating material, and 104 represents the mold. In addition, 1000 denotes a region where the imprint pattern to be transferred onto the coating material is formed. In this figure, the actual embossed portion of the embossed pattern 1000 is not shown. The alignment mark 2070 is provided on the b...

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Abstract

A pattern forming method for forming a pattern, comprising: preparing a mold 104, the mold 104 has a first surface including a pattern area 1000, a second surface opposite to the first surface, and a Alignment mark 2070 at the position of a surface; Make the pattern area 1000 of mold 104 contact with the coating material that is provided on the substrate 5000; 5000 facing each other, by using the alignment mark 2070 and the mark 5300 provided on the substrate 5000, to obtain positional information about the mold 104 and the substrate 5000; and based on the information, implement High-precision alignment of the substrate 5000 and the mold 104.

Description

technical field [0001] The present invention relates to a mold for forming a pattern, a pattern forming method, and a pattern forming apparatus. More specifically, the present invention relates to mold-to-substrate alignment techniques. Background technique [0002] In recent years, fine processing technology for transferring a minute pattern structure on a mold to a member such as resin or metal has been developed. This technique is called nanoimprinting or nanoembossing, and is expected to achieve nanometer-level resolution, so that it can replace exposure equipment such as steppers or scanners as a next-generation semiconductor manufacturing technology. much attention. In addition, according to the nanoimprint technology, a spatial structure can be formed on a wafer as a whole although it varies based on the wafer size. Thus, it is expected that the nanoimprint technology will be widely applied to the field of production technology of optical devices such as photonic c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41N1/24B41M5/26B41K3/00
Inventor 末平信人关淳一真岛正男寺崎敦则稻秀树
Owner CANON KK