Structure and method for packing infrared receiving mould set and surface-adhered mould set
A packaging structure and packaging method technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of general products and methods without suitable structures and methods, inconvenience, etc., to increase diversity, reduce costs, and simplify manufacturing processes the effect of the process
Inactive Publication Date: 2009-07-15
EVERLIGHT ELECTRONICS
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Problems solved by technology
[0005] It can be seen that the above-mentioned existing infrared receiving module, the packaging structure of the surface mount module and the method thereof obviously still have inconvenience and defects in the module structure, packaging method and use, and need to be further improved urgently.
In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and there is no suitable structure and method for general products and methods to solve the above-mentioned problems. This is obviously a problem that relevant industry players are eager to solve
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[0057] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the following in conjunction with the accompanying drawings and preferred embodiments, the packaging structure and its packaging structure of the infrared receiving module and the surface-mounted module proposed according to the present invention. The specific implementation, structure, method, steps, features and effects of the method are described in detail below.
[0058] Please also see figure 2 and image 3 Shown are a perspective view and a side view of a package structure of a surface mount module according to a preferred embodiment of the present invention, respectively.
[0059] In the package structure of the surface mount module (which can also be an infrared receiving module) in the preferred embodiment of the present invention, the bracket 200 has a functional block 201 (bottom layer), a first folding block 202 (side surfa...
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This is an infrared incepting module, its packing structure and the process method. The method includes: 1) installing integrate circuit and optical semi-conducting wafer on circuit diagram on the frame. There are functional section, premier bending cover and secondary bending cover. The functional section is of several hatches to form a circuit diagram. The functional section is separated from the premier cover by a premier fold line, and the premier cover is separated from the secondary cover by a secondary fold line. 2) molding a premier sealing gel on the functional section to seal the wafer and the integrate circuit. 3) bending the frame along the premier and the secondary fold line in order to make the gel sealing be packed by the functional section, premier and secondary cover.
Description
technical field [0001] The present invention relates to an infrared receiving module, a packaging structure of a surface-mounted module and a method thereof, in particular to a functional block of an infrared receiving module having a circuit pattern on a bracket for installing optical semiconductor chips and some electronic components , does not require printed circuit boards, can reduce cost, and only needs one mold opening to simplify the process steps, the packaging structure of the infrared receiving module, the surface mount module and the method thereof. Background technique [0002] With the rapid development of the electronic industry, infrared receiving modules are widely used in various electronic products, but due to the repeated miniaturization of electronic products (such as: MP3 Player, personal digital assistant, etc.), it is difficult to install them on these electronic products. The infrared receiving module in the product also needs to be made smaller and ...
Claims
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IPC IPC(8): H01L25/00H01L25/16H01L21/50
CPCH01L2224/48137H01L2224/48465
Inventor 许晋嘉
Owner EVERLIGHT ELECTRONICS