12results about How to "Simplify the process steps" patented technology

The invention discloses a particle separator sealing clamp, a sealing test device and a sealing test method, and belongs to the technical field of aero-engine tests.The particle separator sealing clamp comprises a positioning plate assembly, a bottom plate assembly, a connecting piece, a pipe joint and a plugging assembly; the positioning plate is used for blocking the first end of a main oil way of the rear section of a cartridge receiver of the particle separator assembly, an air inlet through hole is formed in the positioning plate, the pipe connector is arranged in the air inlet through hole and used for being externally connected with an air source and guiding air into the main oil way of the rear section of the cartridge receiver, and the blocking assembly is used for replacing the pipe connector to be installed in the air inlet through hole and blocking the air inlet through hole. The bottom plate assembly comprises a bottom plate, the bottom plate is used for blocking the second end of the main oil way of the rear section of the cartridge receiver of the particle separator assembly, and the connecting piece is used for connecting and locking the positioning plate and the bottom plate. According to the invention, one set of sealing clamp can meet the requirements of sealing tests in different stages, and the test efficiency and the test accuracy are improved.

The utility model provides a convenient replacement's elevator operation panel, include: control panel, elastic fastening subassembly, control panel side end is provided with button structure, the inside wall of button structure middle is provided with self -adaptation installation component, the both ends of self -adaptation installation component are installed with positioning assembly, the both ends of self -adaptation installation component are provided with elastic locking structure, the both ends of button structure are provided with buffer support subassembly. The utility model provides a convenient replacement's elevator operation panel, through the cooperation of self -adaptation installation component and elastic fastening subassembly of setting, can be convenient to the installation and removal of staff alone to the position of damaged button, and in the installation, structure automatic position clamping, avoid the contact of artificial installation because of the deviation of alignment leads to the poor, button jam. In addition, through the buffer support component of inside wall both ends setting, can protect the button structure in the inside, avoid the direct action of too big impact force on the contactor and other components of internal button.

The present invention provides a packaging structure and a method for making the same. The method for making the packaging structure comprises the following steps. A carrier having a surface is provided. A copper foil layer is laminated on the surface of the carrier. The copper foil layer is subjected to a subtractive process to form a copper foil circuit layer on the carrier. The copper foil circuit layer exposes a portion of the surface of the carrier. A build-up structure layer is formed on the copper foil circuit layer and the surface of the carrier. The first surface of the copper foil circuit layer is flush with the second surface of the build-up structure layer. At least one electronic component is arranged on the build-up structure layer. A packaging colloid is formed to cover the electronic component and the build-up structure layer. The carrier is removed to expose the first surface of the copper foil circuit layer. The packaging structure and the method for making the same of the present invention have better structural reliability and better process yield.

The invention relates to a wafer-level package assembly with a side wettable structure and a manufacturing method thereof. The wafer-level package assembly comprises a substrate, a functional area, a first protective layer and a redistribution layer. Semi-cut grooves are formed in the two opposite side edges of the base material respectively. The functional area is wrapped in the base material and is provided with a connecting pad exposed out of the top surface of the base material. The first protective layer is disposed on the top surface of the substrate and has an opening to expose the connecting pad of the functional region. The redistribution layer is arranged on the first protection layer, is provided with a redistribution circuit, is used for being connected with the connection pad, and extends into the semi-cut groove. In the manufacturing process, the crystal grains do not need to be cut off from the wafer firstly, so that the manufacturing processes of crystal bonding, glue sealing, grinding and the like do not need to be carried out, the manufacturing process steps can be simplified, and the cost can be reduced.

A method for forming a semiconductor structure includes: providing a layer to be etched; forming a plurality of core layers on the layer to be etched, with a first groove between adjacent core layers; forming a sidewall material layer and a first sacrificial layer, wherein the sidewall material layer is located on the sidewall of the core layer and the top surface of the layer to be etched, and the first sacrificial layer is located on the sidewall and top surface of the sidewall material layer; removing the core layer, and forming a first opening in the sidewall material layer and the first sacrificial layer. Since the sidewall material layer is formed before the first opening, the end distance between the adjacent first conductive layers formed subsequently, i.e., the end distance between the adjacent core layers, is consistent with the expected target. In addition, since the end distance between the adjacent first conductive layers is consistent with the expected target, the length of the corresponding first conductive layer is increased, and when performing the connection process between metal wires, the position of the conductive plug connecting the first conductive layer has a better degree of freedom.

The invention discloses a thick copper plate tin spraying process design and manufacturing method, and relates to the field of thick copper plate tin spraying, and the method comprises the following steps: firstly, preparing and cutting raw materials, carrying out pretreatment and inner layer manufacturing after the preparation and cutting of the raw materials, and carrying out brownification and lamination along with the completion of the pretreatment and inner layer manufacturing, drilling and slot milling are carried out after brownification and lamination are completed, circuit manufacturing and electroplating are carried out after drilling and slot milling are completed, and etching and outer layer detection are carried out after circuit manufacturing and electroplating are completed. According to the tin spraying process design and manufacturing method of the thick copper plate, during CAM data manufacturing, a side rail area, 5 mm away from a set area, of a pnl is set as a copper-free area, glue shortage and cavities occur after lamination of the copper-free area, in order to prevent glue shortage in the plate, the pnl, 5 mm away from the set area, of the pnl is set as a copper laying area, an edge milling process is added before tin spraying, a frame of the outer edge of the PNL is milled away by 5 mm, and the cavities leak out; a channel is provided for stress release and water vapor discharge, and the problem of board explosion and hole explosion of the circuit board is prevented.

The invention discloses a charger starting circuit and a charger, and relates to the power supply field, a step-down conversion module is used for carrying out step-down on an AC power supply, a first rectification module is used for converting the step-down AC power supply into a DC power supply, and when the first rectification module outputs the DC power supply, a first control module controls a first controllable switch to be closed; the direct current activates the charger control unit. Therefore, when the alternating current power supply is the power supply for the garage, the converted direct current can supply power to the charger control unit, and when the storage battery is lack of power, the alternating current power supply can be the power supply in the garage, and the direct current electric energy converted from the alternating current can activate the charger control unit and the charger to charge the storage battery lack of power. And the storage battery does not need to be charged by using a mobile charger or another train, so that the cost of charging equipment is reduced, and the process steps are relatively simple.

The application provides a tank truck wave baffle manufacturing equipment, and relates to the field of metal stamping. The tank truck wave baffle manufacturing equipment comprises a first stamping device for stamping and flanging a metal plate to form a first hole and a flange structure, wherein the first stamping device has a first state and a second state; and a second stamping device for stamping the metal plate to form a second hole, wherein the second hole is distributed in a circle with the center axis of the first hole as an axis. When the first stamping device is in the first state, it is used for stamping and flanging the metal plate, and when the first stamping device is in the second state, the metal plate can rotate relative to the first stamping device. The process steps required for stamping processing are simplified, the continuity of the processing process is maintained, thereby facilitating the reduction of the process complexity to a certain extent, the improvement of the processing efficiency, and the help for obtaining a more stable and consistent manufacturing effect.

The present invention relates to the field of packaging technology, and in particular to a semiconductor packaging structure and a method for forming the same. The method for forming the packaging structure comprises the following steps: providing a substrate; forming a plurality of mutually independent conductive traces on the substrate, with grooves exposing the substrate between adjacent conductive traces; oxidizing the sidewalls of the conductive traces to form a barrier layer; and forming a solder resist layer that at least fills the grooves. The present invention forms a barrier layer by oxidizing the sidewalls of the conductive traces. On the one hand, the barrier layer can block the electrical migration of conductive particles in the conductive traces, thereby reducing the probability of short circuits between adjacent conductive traces. On the other hand, the barrier layer is formed directly by oxidizing the conductive traces, which is simple in process, simplifies the process steps of the semiconductor packaging structure, and improves the production efficiency of the semiconductor packaging structure.

The utility model discloses a degreasing device for manufacturing a numerical control machine tool, belongs to the technical field of numerical control machining, and aims to solve the problems that in the prior art, greasy dirt treatment steps are more, the integration level of a treatment device is insufficient, workpieces need to be transferred in multiple ways in the treatment process, the greasy dirt treatment efficiency is reduced, and the machining cost is reduced. And the labor intensity of workpiece transfer is increased. Comprising a treatment table, a cleaning plate and a placement table, a plurality of conveying rollers are distributed on the upper surface of the placement table at intervals, the placement table is located above the treatment table, the side wall of the placement table is obliquely arranged, an embedded groove is formed in the inclined face of the placement table, and a push plate is embedded in the embedded groove; a plurality of groups of lower cleaning rollers are distributed on the upper surface of the treatment table at intervals, a suspended cleaning plate is arranged above the lower cleaning rollers, and upper cleaning rollers are arranged on the surface, facing the lower cleaning rollers, of the cleaning plate. The degreasing device for manufacturing the numerical control machine tool is simple in process step and high in operation continuity.

The present invention discloses a positioning and crimping device for a display module, comprising a substrate, a buckling plate fixed on the substrate, a seesaw fixed on the substrate; and a floating plate; the buckling plate comprises a push rod; the seesaw comprises a first bridge arm and a second bridge arm; the seesaw is configured to convert the force applied by the push rod to the first bridge arm into a force driving the floating plate to move upward through the second bridge arm; the device also comprises a hook member located on the substrate; the hook member comprises a closed position for fixing the display module on the table top, and an unfolded position for releasing the display module; the floating plate comprises a corresponding part that cooperates with the hook member to drive the hook member to switch between the closed position and the unfolded position. When the present invention implements a crimping and continuity test on the display module, the positioning of the display module relative to the positioning and crimping device and the crimping and continuity testing process are simplified.

The invention relates to the technical field of microscope imaging, and discloses an operation method for observing a perforated plate by a microscope, which comprises the following steps: dripping a culture into pores of the perforated plate, and putting the perforated plate with the culture on an electric control objective table of the microscope; automatically scanning holes by using a microscope low-power lens, and scanning each hole to obtain a first image; through automatic processing of the first image, whether a culture exists in each hole of the perforated plate or not is analyzed, and the analysis result comprises the position of the center of the culture in the hole containing the culture; selecting a hole needing to be shot according to an analysis result; and shooting the hole needing to be shot by using a microscope high-power lens to obtain a second image, and processing and analyzing the second image to obtain an experimental conclusion. According to the method, naked eye identification errors are reduced, the overall process steps are simplified, and a large amount of time is also saved.