Electroplating bath
A technology of electroplating tank and electroplating solution, which is applied in the direction of plating tanks, circuits, electrical components, etc., can solve problems such as difficult control of uniformity, and achieve the effects of consistent surface loss, stable deposition rate, and reduced quantity
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[0052]In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0053] The implementation of the present invention will be described in detail below in conjunction with specific drawings.
[0054] Such as figure 2 Shown in -4a, is the preferred embodiment that the present invention provides.
[0055] An electroplating tank provided in this embodiment is a working tank where electroplating occurs, and is used to deposit copper or gallium or indium or selenium on a surface of a substrate. It can be understood that the substrate is conducive to the deposition of a CIGS absorbing layer. Made of conductive materials, such as aluminum foil, titanium foil, molybd...
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