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Chemomechanical grinder and its grinding pad regulating method

An adjustment method and a technology of a grinding device, which are applied in the direction of grinding devices, grinding machine tools, electrical components, etc., can solve the problems of limited adjustment effect of the grinding pad 120, and achieve the effect of improving the grinding effect

Active Publication Date: 2009-08-12
UNITED MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, only the adjustment action of providing chemical liquid to the polishing pad 120 from the polishing pad regulator 150 has limited effect on the adjustment of the polishing pad 120

Method used

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  • Chemomechanical grinder and its grinding pad regulating method
  • Chemomechanical grinder and its grinding pad regulating method

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Experimental program
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Embodiment Construction

[0041] figure 2 It is a schematic diagram of a chemical mechanical polishing device in a preferred embodiment of the present invention. Please refer to figure 2 , The chemical mechanical polishing device 200 of this embodiment at least includes a polishing disc 210 , a polishing pad 220 , a polishing liquid supply pipeline 230 , a polishing pad regulator 250 , a chemical liquid supply pipeline 260 and a distribution pipeline 280 .

[0042] Please refer to figure 2 , the grinding disc 210 is arranged on a carrier machine (not shown), and the grinding disc 210 is driven to rotate through the carrier machine (not shown), and the grinding pad 220 is arranged on the grinding disc 210, and the grinding pad 220 is accompanied by the grinding The disc 210 rotates simultaneously to remove the layer to be ground.

[0043] Please continue to refer to figure 2 , there are a plurality of grinding liquid outlets 212 on the surface of the grinding disc 210, and the grinding liquid su...

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Abstract

The chemomechanical grinder includes at least one grinding pan, one grinding pad, one grinding fluid supplying pipeline, one grinding pad regulator, one chemical fluid supplying pipeline and one dividing pipeline. The grinding disc has grinding fluid outlets in the surface and grinding pad configured on it. The grinding pad regulator is configured over the grinding pad, and the chemical fluid supplying pipeline is connected to the grinding pad regulator for supplying chemical grinding fluid to the regulator. The dividing pipeline is connected between the grinding fluid supplying pipeline and the chemical fluid -supplying pipeline for supplying the grinding fluid and the chemical fluid to the surface of the grinding pad. The chemomechanical grinder has excellent grinding effect.

Description

technical field [0001] The invention relates to a chemical mechanical polishing (CMP) device, in particular to a chemical mechanical polishing device suitable for providing a good polishing effect and a method for adjusting a polishing pad thereof. Background technique [0002] As the device size continues to shrink, the lithography exposure resolution needs to be improved accordingly. And with the reduction of the exposure depth of field, the requirements for the tolerance of the high and low contours of the chip surface will be more stringent. Chemical mechanical polishing is currently a technology that can provide comprehensive planarization of VLSI processes. Its anisotropic abrasive properties can not only be used for the planarization of chip surface contours, but also can be applied to vertical and horizontal through metal polishing. The production of metal wire connections (Interconnects), or the production of shallow trench isolation of components in the front-end ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/04H01L21/304
Inventor 陈胜裕洪德松成忠荣郑锜彪郑博元
Owner UNITED MICROELECTRONICS CORP