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Method and device for forming modularized electronic component and modularized electronic component

A modular technology for electronic devices, applied to household components, electrical components, printed circuit components, etc., can solve problems such as processing accuracy limitations

Inactive Publication Date: 2009-08-26
SONY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, the machining accuracy of each of the upper and lower molds 6 and 7 and the bottom plate 3' naturally has its limits, and each of the upper and lower molds 6 and 7 and the bottom plate 3' has a predetermined dimensional tolerance

Method used

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  • Method and device for forming modularized electronic component and modularized electronic component
  • Method and device for forming modularized electronic component and modularized electronic component
  • Method and device for forming modularized electronic component and modularized electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] Figure 7 An embodiment of a modular electronic device according to the invention is shown. This embodiment is shown in the form of a modular electronic device 20 . The modular electronic device 20 is obtained as a resin molding that can be easily coupled with and detached from a connector provided on an electronic device such as a personal computer, for example, for a card-type information recording medium.

[0040] Such as Figure 7 The illustrated modular electronic device has an upper part 21 , a lower part 22 and a bottom plate 23 shaped as a rectangle and placed between the upper part 21 and the lower part 22 . A plurality of terminals 24 and a plurality of isolation ribs 25 are fixed and arranged on the bottom plate 23 . Each of the terminals 24 is placed between a pair of ribs 25 adjacent to each other, although in Figure 7 not shown in A plurality of ribs 25 , upper part 21 and lower part 22 constitute an integral resin molded part, and upper part 21 and ...

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PUM

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Abstract

A method of forming a modular electronic device comprising a substrate (23) and resin molded parts (21, 22) on which are arranged a plurality of terminal parts (24) with curved tips part (24a), the resin molding part covers the substrate (23), and a plurality of terminal parts (24) are exposed to the outside, the method comprises the following steps: when the upper mold box (30) and the lower mold box (31) When moving from a mutually separated state to a mutually contacted state to form a molding space for storing a substrate (23) as a molding material, the tip corners (24a' arranged at a plurality of ends (24) of the substrate (23) ) to apply extrusion molding, to fill the molten resin (36) into the molding space of the storage substrate (23), and the curved portion (30R) is in close contact with the portion formed by the tip corner (24a′), and at (36 ) after curing, the upper mold box (30) and the lower mold box (31) are separated.

Description

technical field [0001] The present application relates to a method of molding modular electronic devices, each of which can be easily coupled to and detached from connectors provided on the electronic device, for example for storing data therein and reading therefrom An information recording medium for acquiring data, and also relates to a device molded by the method or a modular electronic device molded by the method. Background technique [0002] A variety of modular electronic devices have been widely disseminated, each of which can be easily coupled to and detached from connectors provided on electronic devices such as personal computers, information recording and reproducing devices, etc., For use in, for example, a card-type information recording medium that operates under the condition of being electrically connected to an electronic device. For example, one of the previously proposed modular electronics such as figure 1 and 2 constructed as shown. [0003] refer ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C45/14H05K1/11H05K3/28
CPCB29C45/14418B29L2031/3481H05K1/117B29C45/14639B29C45/14221H05K3/284B29C2045/0036B29C45/14
Inventor 森永昌二足立充姬野雄治
Owner SONY CORP