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Fluid jet device

A fluid injection and fluid technology, which is applied in the direction of injection device, injection device, semiconductor/solid device manufacturing, etc., can solve the problem that the fluid cannot be injected, and achieve the effect of reducing the size of the nozzle and preventing it from being untreated

Active Publication Date: 2009-09-09
WEIHAI DMS OPTICAL ELECTROMECHANICAL CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in the existing fluid ejection device, when the fluid is ejected through the nozzle K, the surface tension is generated due to the attractive force between the molecules constituting the fluid, which causes the fluid to incline at a certain angle θ toward the inner side of the substrate.
[0008] Therefore, the prior art has the problem that the fluid cannot be sprayed to the edge E of the substrate.

Method used

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Embodiment Construction

[0022] Next, the structure of the fluid ejection device of the present invention will be described in detail with reference to the drawings.

[0023] first, figure 2 is a perspective view of a nozzle of a fluid injection device according to a preferred embodiment of the present invention, image 3 is displayed figure 2 A schematic diagram of the structure of the bottom of the nozzle in the fluid ejection device shown, Figure 4 By figure 2 Schematic diagram of the state of the fluid sprayed by the nozzle shown.

[0024] like figure 2 As shown, the fluid ejection device 1 of the present invention may be disposed above the substrate G conveyed by the conveying roller R. As shown in FIG.

[0025] The fluid ejection device 1 comprises: a nozzle 2, which has a discharge port 5 for spraying a fluid W onto the substrate G; a guide device, which is arranged at both ends of the discharge port 5 of the nozzle 2, for guiding the injection of the fluid Direction, so that the flu...

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PUM

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Abstract

A fluid spraying device is provided to prevent a rim portion of a substrate from being untouched by vertically spraying fluid on the substrate through a spraying hole. A fluid spraying device includes a nozzle(2) and a guide unit. A spraying hole(5) for spraying fluid on a substrate(G) is formed on the nozzle. The guide units are formed at both sides of the spraying hole of the nozzle, such that the fluid is sprayed on an overall surface of the substrate. The guide unit includes first and second fluid focusing grooves(7,9), which spray a larger amount of the focused fluid than the fluid, which is sprayed through the spraying hole. An area of the focusing groove is greater than the area per unit length of the spraying hole.

Description

technical field [0001] The present invention relates to a fluid ejection device, in particular to a fluid ejection device which guides the fluid to be ejected in a vertical direction through an improved structure, so that the fluid can be ejected on the entire surface of the substrate, thereby improving the processing efficiency of the substrate. Background technique [0002] Generally, a fluid ejection device is a device that ejects a fluid such as a chemical solution onto the surface of a substrate. Such a fluid ejection device can be applied in various fields according to its use. [0003] That is, it can be applied to various devices such as a coating device that applies a chemical solution to a substrate to form a coating layer, or a cleaning device that sprays a cleaning liquid to remove impurities on a substrate. [0004] figure 1 It is a schematic diagram of the nozzle structure in the existing fluid ejection device. [0005] like figure 1 As shown, the nozzle K ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05B1/26B05B15/04
CPCH01L21/67017
Inventor 金银洙
Owner WEIHAI DMS OPTICAL ELECTROMECHANICAL CO LTD